Thermomechanical properties of nanocomposites based on clinoptilolite and copolymer of ethylene with hexen

2020 ◽  
pp. 58-66
Author(s):  
N. T. Kakhramanov ◽  
◽  
I. V. Bayramova ◽  
S. S. Pesetsky ◽  
◽  
...  
Keyword(s):  
Thermomechanical Properties

Materials Issues and Characterization of Low-k Dielectric Materials

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho
Keyword(s):  
Process Integration ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Thermomechanical Properties ◽  
General Criterion ◽  
Crosstalk Noise ◽  
Total Delay ◽  
Interlayer Dielectrics ◽  
Performance Improvements ◽  
And Performance

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

Influence of filler hybridization on thermomechanical properties of hemp/silver epoxy composite

2020 ◽  
pp. 096739112097811
Author(s):  
Munjula Siva Kumar ◽  
Santosh Kumar ◽  
Krushna Gouda ◽  
Sumit Bhowmik
Keyword(s):  
Thermal Conductivity ◽  
Silver Nanoparticles ◽  
Epoxy Polymer ◽  
Hybrid Composites ◽  
Conductive Filler ◽  
Weight Fraction ◽  
Mechanical Analysis ◽  
Thermomechanical Properties ◽  
Material Behavior ◽  
Good Crystallinity

The polymer composite material’s thermomechanical properties with fiber as reinforcement material have been widely studied in the last few decades. However, these fiber-based polymer composites exhibit problems such as fiber orientation, delamination, fiber defect along the length and bonding are the matter of serious concern in order to improve the thermomechanical properties and obtain isotropic material behavior. In the present investigation filler-based composite material is developed using natural hemp and high thermal conductive silver nanoparticles (SNP) and combination of dual fillers in neat epoxy polymer to investigate the synergetic influence. Among various organic natural fillers hemp filler depicts good crystallinity characteristics, so selected as a biocompatible filler along with SNP conductive filler. For enhancing their thermal conductivity and mechanical properties, hybridization of hemp filler along with silver nanoparticles are conducted. The composites samples are prepared with three different combinations such as sole SNP, sole hemp and hybrid (SNP and hemp) are prepared to understand their solo and hybrid combination. From results it is examined that, chemical treated hemp filler has to maximized its relative properties and showed, 40% weight % of silver nanoparticles composites have highest thermal conductivity 1.00 W/mK followed with hemp filler 0.55 W/mK and hybrid 0.76 W/mK composites at 7.5% of weight fraction and 47.5% of weight fraction respectively. The highest tensile strength is obtained for SNP composite 32.03 MPa and highest young’s modulus is obtained for hybrid composites. Dynamic mechanical analysis is conducted to find their respective storage modulus and glass transition temperature and that, the recorded maximum for SNP composites with 3.23 GPa and 90°C respectively. Scanning electron microscopy examinations clearly illustrated that formation of thermal conductivity chain is significant with nano and micro fillers incorporation.

scholarly journals The Effect of Surface Treatment with Isocyanate and Aromatic Carbodiimide of Thermally Expanded Vermiculite Used as a Functional Filler for Polylactide-Based Composites

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 890
Author(s):  
Mateusz Barczewski ◽  
Olga Mysiukiewicz ◽  
Aleksander Hejna ◽  
Radosław Biskup ◽  
Joanna Szulc ◽  
...  
Keyword(s):  
Impact Strength ◽  
Mechanical Stability ◽  
Thermomechanical Analysis ◽  
Thermomechanical Properties ◽  
Phenyl Isocyanate ◽  
Sem Analysis ◽  
Scanning Calorimetry ◽  
Melt Mixing ◽  
Expanded Vermiculite ◽  
Chain Extenders

In this work, thermally expanded vermiculite (TE-VMT) was surface modified and used as a filler for composites with a polylactide (PLA) matrix. Modification of vermiculite was realized by simultaneous ball milling with the presence of two PLA chain extenders, aromatic carbodiimide (KI), and 4,4’-methylenebis(phenyl isocyanate) (MDI). In addition to analyzing the particle size of the filler subjected to processing, the efficiency of mechanochemical modification was evaluated by Fourier transform infrared spectroscopy (FTIR) and scanning electron microscopy (SEM). The composites of PLA with three vermiculite types were prepared by melt mixing and subjected to mechanical, thermomechanical, thermal, and structural evaluation. The structure of composites containing a constant amount of the filler (20 wt%) was assessed using FTIR spectroscopy and SEM analysis supplemented by evaluating the final injection-molded samples’ physicochemical properties. Mechanical behavior of the composites was assessed by static tensile test and impact strength hardness measurements. Heat deflection temperature (HDT) test and dynamic thermomechanical analysis (DMTA) were applied to evaluate the influence of the filler addition and its functionalization on thermomechanical properties of PLA-based composites. Thermal properties were assessed by differential scanning calorimetry (DSC), pyrolysis combustion flow calorimetry (PCFC), and thermogravimetric analysis (TGA). The use of filler-reactive chain extenders (CE) made it possible to change the vermiculite structure and obtain an improvement in interfacial adhesion and more favorable filler dispersions in the matrix. This translated into an improvement in impact strength and an increase in thermo-mechanical stability and heat release capacity of composites containing modified vermiculites.

scholarly journals Kinetical Study, Thermo-Mechanical Characteristics and Recyclability of Epoxidized Camelina Oil Cured with Antagonist Structure (Aliphatic/Aromatic) or Functionality (Acid/Amine) Hardeners

Polymers ◽  
2021 ◽  
Vol 13 (15) ◽  
pp. 2503
Author(s):  
Chiara Di Mauro ◽  
Aratz Genua ◽  
Alice Mija
Keyword(s):  
Disulfide Bonds ◽  
Mechanical Characteristics ◽  
Dicarboxylic Acids ◽  
Thermomechanical Properties ◽  
Chemical Recycling ◽  
Camelina Oil ◽  
Ft Ir ◽  
Tan Δ ◽  
The Individual ◽  
First Time

In an attempt to prepare sustainable epoxy thermosets, this study introduces for the first time the idea to use antagonist structures (aromatic/aliphatic) or functionalities (acid/amine) as hardeners to produce reprocessable resins based on epoxidized camelina oil (ECMO). Two kinds of mixtures were tested: one combines aromatic/aliphatic dicarboxylic acids: 2,2′-dithiodibenzoic acid (DTBA) and 3,3′-dithiodipropionic acid (DTDA); another is the combination of two aromatic structures with acid/amine functionality: DTBA and 4-aminophenyl disulfide (4-AFD). DSC and FT-IR analyses were used as methods to analyze the curing reaction of ECMO with the hardeners. It was found that the thermosets obtained with the dual crosslinked mechanism needed reduced curing temperatures and reprocessing protocols compared to the individual crosslinked thermosets. Thanks to the contribution of disulfide bonds in the network topology, the obtained thermosets showed recycling ability. The final thermomechanical properties of the virgin and mechanical reprocessed materials were analyzed by DMA and TGA. The obtained thermosets range from elastomeric to rigid materials. As an example, the ECMO/DTBA704-AFD30 virgin or reprocessed thermosets have tan δ values reaching 82–83 °C. The study also investigates the chemical recycling and the solvent resistance of these vitrimer-like materials.

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