Phase equilibrium of (CuS + Ag2S + Ag1.55Cu0.45S) and thermodynamic quantities for the ternary-phase Jalpaite from e.m.f. measurements in solid-state galvanic cells

The evolution of interfacial microstructure of eutectic SnAgCu and SnPb solders on Al/Ni(V)/Cu thin films was investigated after various heat treatments. In the eutectic SnPb system, the Ni(V) layer was well protected after 20 reflow cycles at 220 °C. In the SnAgCu solder system, after 5 reflow cycles at 260 °C, the (Cu,Ni)6Sn5 ternary phase formed and Sn was detected in the Ni(V) layer. After 20 reflow cycles, the Ni(V) layer disappeared and spalling of the (Cu,Ni)6Sn5 was observed, which explains the transition to brittle failure mode after ball shear testing. The different interfacial reactions that occurred in the molten SnAgCu and SnPb systems were explained in terms of different solubilities of Cu in the two systems. The dissolution and formation of the (Cu,Ni)6Sn5phase were discussed on the basis of a Sn–Ni–Cu phase diagram. In the solid-state aging study of the SnAgCu samples annealed at 150 °C for up to 1000 h, the Ni(V) layer was intact and the intermetallic compound formed was Cu6Sn5 and not (Cu,Ni)6Sn5, which is the same as was observed for the eutectic SnPb system.

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15–19 September 1980 3rd international meeting on solid electrolytes “solid state ionics and galvanic cells”, Tokyo, Japan

Solid State Communications ◽

10.1016/0038-1098(80)91133-3 ◽

1980 ◽

Vol 34 (12) ◽

pp. vii ◽

Cited By ~ 1

Keyword(s):

Solid State ◽

Solid Electrolytes ◽

International Meeting ◽

Galvanic Cells ◽

Solid State Ionics

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Thermodynamic investigation of CuSn alloys with solid state galvanic cells

Thermochimica Acta ◽

10.1016/0040-6031(79)87035-5 ◽

1979 ◽

Vol 33 ◽

pp. 119-126 ◽

Cited By ~ 15

Author(s):

Ferdinand Sommer ◽

Werner Balbach ◽

Bruno Predel

Keyword(s):

Solid State ◽

Thermodynamic Investigation ◽

Galvanic Cells

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Solid-state synthesis and characterization of the ternary phase Ti3SiC2

Journal of Materials Science ◽

10.1007/bf00352037 ◽

1994 ◽

Vol 29 (13) ◽

pp. 3384-3392 ◽

Cited By ~ 247

Author(s):

C. Racault ◽

F. Langlais ◽

R. Naslain

Keyword(s):

Solid State ◽

Ternary Phase ◽

Solid State Synthesis ◽

Synthesis And Characterization

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Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

MRS Proceedings ◽

10.1557/proc-323-131 ◽

1993 ◽

Vol 323 ◽

Author(s):

Alan J. Mockler ◽

Peter J. Goodhew ◽

Elizabeth A. Logan

Keyword(s):

Heat Treatment ◽

Solid State ◽

Ternary Phase ◽

Flip Chip ◽

Phase Distribution ◽

Intermetallic Phases ◽

Ternary Diagram ◽

Solid State Diffusion ◽

Analysis Techniques ◽

State Diffusion

AbstractThe microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

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