Ultrasonic Fluxless Soldering of Eutectic SnPb and SnAgCu Alloys: A Feasibility Study

Compared with the traditional eutectic SnPb soldering, lead-free soldering has been a focal point for electronics packaging research in order for the industry to meet the regulations on environment protection. By eliminating the lead element from soldering process, the concerns on environmental pollution can be significantly reduced. However, the current lead-free soldering processes usually still require the flux chemicals for promoting wetting. The use of flux chemicals is not environmentally friendly. In this study, motivated by the potential benefits of soldering using ultrasonic energy, we carry out a feasibility study of ultrasonic fluxless soldering experiments on both the regular eutectic SnPb soldering alloy, Sn63Pb37 and the popular SnAgCu alloy, SAC305. By developing the appropriate testing conditions, the solder joints are successfully formed using the dipping ultrasonic soldering method regardless if chemical flux is applied. The effects of soldering time, temperature, and ultrasonic power are investigated. The results from SEM observation and EDS element analysis indicate that the use of chemical flux produces thicker intermetallic compound (IMC) layers for Sn63Pb37 alloy, and a longer soldering time leads to thicker IME layers for both solder alloys. However, a higher soldering temperature may not be beneficial to the growth of IME layer in ultrasonic soldering of SAC305 alloy. However, the driving mechanisms behind the phenomena remain to be investigated in the future.

Continuous Production of a Multi-Filament Reinforced Metal Matrix Composite Strip from the Semisolid State

Continuous metal matrix composite strip casting (MMCS-ing) composed of six 0.3-mm diameter annealed bare copper wires in a eutectic SnPb matrix was manufactured by a two-roll melt dragged processing (TRMD-ing) method at a rate of 0.3 m/s. The wires were dragged through a semisolid pool with a fibre contact time of approximately 0.2 s. The required gap between rolls to thixoforge the semisolid material around the wire filaments was approximately 1.4 mm. A successful continuous composite strip casting was achieved with a notably good degree of wire alignment. No cracks were observed at the copper wire/matrix interface. However, regions of porosity occurred in the matrix; their possible formation mechanisms are discussed. The solidification structure of the matrix was analysed, and the analysis results indicated the formation of small globular grains measuring approximately 3 μm in diameter. The specimens were evaluated for their tensile properties and compared with the rule of mixtures. The surface fracture analysis indicated a good matrix/fibre union. MMCS-ing is an economically viable process and has significant advantages over other metal matrix composite (MMC) fabrication methods.

Continuous Production of Metal Matrix Composites from the Semisolid State

Continuous strip metal matrix composite (MMC) casting of 0.3 mm diameter hard-drawn stainless steel (316L) wire in a quasi-eutectic SnPb (64Sn36Pb) matrix was performed by a two-roll melt drag processing (TRMDping) method, with the wire being dragged through a semisolid puddle with a fibre contact time of approximately 0.2 s. A slag weir placed at the nozzle contained two wire guide holes: one located near the upper roll, and the other located between the rolls. A successful continuous composite strip casting with good fibre alignment was achieved by inserting and embedding the wire into the matrix using the guide hole between the rolls. Degeneration of eutectic/dendrite structures led to the formation of globular structures. The occurrence and formation mechanisms of cracks, de-lamination and voids in the matrix were discussed. TRMDping is economically viable and has significant benefits over other MMC fabrication methods.

Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors

The understanding of the effects of temperature cycling parameters, such as dwell and ramp times, mean cyclic temperature, and temperature range, on the fatigue life of solder interconnects is critical for qualification and reliability testing. After the solder achieves complete stress relaxation, a further increase in dwell time does not decrease the fatigue life of solder interconnects. Studies have shown that an increase in dwell time beyond a certain limit (10–20 minutes) has no effect on the fatigue life of eutectic tin-lead solder when cycled at peak cycle temperatures at or above 100°C. The duration of stress relaxation is longer in SnAgCu and SnCu solders than in eutectic tin-lead solder, resulting in higher creep damage accumulation and thereby reducing the fatigue life of solder interconnects. Experimental data for modeling of the effects of extended dwell time (beyond 60 minutes) on the temperature cycling reliability of tin-silver-copper solders is limited. In this study, forty 2512 ceramic chip resistors soldered onto an FR4 board using SAC105, SAC305, SN100C, and eutectic SnPb solders were subjected to temperature cycling tests with dwell time durations of 10 and 120 minutes, respectively. Resistors soldered on standard and narrow pads were compared to study the effects of pad size on thermal fatigue reliability. In eutectic SnPb-soldered narrow pad resistors, the increase in dwell time to 120 minutes did not change the cycles to failure. However, SnPb-soldered standard pad resistors showed a decrease in fatigue life with the increase in dwell time. For SAC105- and SAC305-soldered narrow and standard pad resistors, the 120-min dwell decreased the thermal fatigue life, compared to the 10-min dwell. The thermal fatigue life of SN100C-soldered narrow pad resistors increased when the dwell time was increased to 120 minutes, while that of the standard pad decreased. In the case of narrow pad resistors, extended dwell may be have annealed the SN100C solder, making it more robust to solder fatigue.