Crack tip plasticity and crack growth in a single-crystal superalloy at elevated temperatures

1984 ◽  
Vol 64 (1) ◽  
pp. 37-43 ◽  
Author(s):  
J.S. Crompton ◽  
J.W. Martin
Author(s):  
Daisuke Kobayashi ◽  
Katsuhiro Takama ◽  
Tomihiko Ikeda

Abstract Needless to say, it is important to estimate the stress applied to a material when conducting failure analysis. In recent years, a material assessment method using electron back-scatter diffraction (EBSD) has been developed. It has been reported that a characteristic misorientation distribution corresponding to the fracture mode is seen in cross-sectional EBSD observation near the fracture surface of a Ni-based superalloy. Furthermore, the authors discovered EBSD striations on the crack cross-section, which is formed with each fatigue crack growth during a turbine shut-down process. This was discovered in misorientation analysis on a single-crystal superalloy blade used in a commercial land-based gas turbine. Since Ni-based superalloys have high deformation resistance, they do not undergo enough ductile deformation to form striations at the crack tip on the fracture surface during fatigue crack growth, and, as a result, striations corresponding to cyclic loadings are rarely observed in fractography. Even in such a Ni-based superalloy with brittle crack growth, the fatigue crack growth rate and the applied stress can be estimated by measuring EBSD striation spacing in misorientation analysis. However, a practical problem in assessment is that the resolution limit fixed with field emission scanning electron microscopes (FE-SEM) determine the range in which crack growth rate can be assessed. Hence, it is difficult to clearly discriminate the EBSD striations when the fatigue crack growth rate is too low, such as in the low stress intensity factor range (ΔK) region. The applied stress can be calculated from ΔK. Therefore, in this paper, in order to estimate the applied stress during fatigue crack growth, we focused on estimating ΔK by measuring the plastic zone size along the crack growth.


2001 ◽  
Vol 81 (5) ◽  
pp. 1283-1303 ◽  
Author(s):  
K. Sadanandaa, Dorai-Nirmal V. Ramaswamy

Author(s):  
P. Kapadia ◽  
H. Zhou ◽  
C. M. Davies ◽  
R. C. Wimpory ◽  
K. M. Nikbin

Residual stresses are induced in components when fabrication processes produce internal stresses or local deformation and cause accelerated creep damage and cracking during service at elevated temperatures. A method of inducing residual stresses in laboratory fracture specimens is proposed where an oversized wedge is inserted into the crack mouth of a compact tension, C(T), type specimen. In this way the extent of internal stresses can be controlled in order to minimise the level of crack tip plasticity which inherently reduces the remaining strain to failure. Numerical simulations of wedge insertion into specimens made of 316H austenitic stainless steel have been developed to calibrate the wedge insertion process. These models have been experimentally validated using surface strains measured during the wedge insertion, using Digital Image Correlation (DIC), and Neutron Diffraction (ND) measurements. The validated Finite Element (FE) model is used to determine the wedge insertion depth required to maximise the residual stresses without causing significant crack tip plasticity. The validated numerical simulation is used to determine the wedge insertion depths of further wedge-loaded C(T) specimens made from uniformly pre-compressed 316H stainless steel. The reduced creep ductility of this material increases the rate of crack growth under creep conditions. This method of inducing residual stresses with limited crack tip plasticity allows creep crack growth under simulated secondary loading conditions to be investigated without the influence of non-uniform creep ductility caused by work hardening.


2012 ◽  
Vol 430 (1-3) ◽  
pp. 96-105 ◽  
Author(s):  
Yongfeng Zhang ◽  
Xiang-Yang Liu ◽  
Paul C. Millett ◽  
Michael Tonks ◽  
David A. Andersson ◽  
...  

2007 ◽  
Vol 454-455 ◽  
pp. 357-366 ◽  
Author(s):  
Y. Liu ◽  
J.J. Yu ◽  
Y. Xu ◽  
X.F. Sun ◽  
H.R. Guan ◽  
...  

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