Proposed failure mechanism in a discontinuously reinforced aluminum alloy

1987 ◽  
Vol 21 (2) ◽  
pp. 181-185 ◽  
Author(s):  
C.P. You ◽  
A.W. Thompson ◽  
I.M. Bernstein
Keyword(s):  
Aluminum Alloy ◽  
Failure Mechanism

Experimental Studies on Strengthening and Failure Mechanism for the Metal/Silicone Rubber/Metal Bonding System

2018 ◽  
Vol 10 (03) ◽  
pp. 1850029 ◽  
Author(s):  
Jingchuan Li ◽  
Lihong Liang ◽  
Xiaoming Liu ◽  
Hansong Ma ◽  
Jingru Song ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Failure Mechanism ◽  
Layer Thickness ◽  
Silicone Rubber ◽  
Adhesive Layer ◽  
Normal Strain ◽  
Failure Strength ◽  
Metal Bonding ◽  
Bonding System ◽  
Average Shear

In the present research, we carry out a systematical experimental investigation on the strength, toughness and failure mechanism of the metal/silicone rubber/metal bonding system. For the case of the aluminum alloy cylinder/silicone rubber/aluminum alloy cylinder bonding system, we measure the tensile deformation and failure behaviors, including the dependence of the failure loading on the adhesive layer thickness and scarf angle. Through introducing a series of definitions, such as average normal stress, average shear stress, average normal strain and average shear strain, along the bonding interface, we realize the measurements on interfacial failure strength, and obtain the relationship between the interfacial strength and the interfacial scarf angle as well as adhesive layer thickness, and we further obtain the failure strength surface, interfacial fracture energy, as well as the energy release rate for the bonding system. The obtained results can provide a scientific basis for deeply understanding the strength and toughness properties as well as the failure mechanism of the metal-adhesive bonding system, and have an important guidance on optimization design and property evolution of the bonding system.

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Sign in / Sign up

Export Citation Format

Share Document