Experimental Studies on Strengthening and Failure Mechanism for the Metal/Silicone Rubber/Metal Bonding System

2018 ◽  
Vol 10 (03) ◽  
pp. 1850029 ◽  
Author(s):  
Jingchuan Li ◽  
Lihong Liang ◽  
Xiaoming Liu ◽  
Hansong Ma ◽  
Jingru Song ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Failure Mechanism ◽  
Layer Thickness ◽  
Silicone Rubber ◽  
Adhesive Layer ◽  
Normal Strain ◽  
Failure Strength ◽  
Metal Bonding ◽  
Bonding System ◽  
Average Shear

In the present research, we carry out a systematical experimental investigation on the strength, toughness and failure mechanism of the metal/silicone rubber/metal bonding system. For the case of the aluminum alloy cylinder/silicone rubber/aluminum alloy cylinder bonding system, we measure the tensile deformation and failure behaviors, including the dependence of the failure loading on the adhesive layer thickness and scarf angle. Through introducing a series of definitions, such as average normal stress, average shear stress, average normal strain and average shear strain, along the bonding interface, we realize the measurements on interfacial failure strength, and obtain the relationship between the interfacial strength and the interfacial scarf angle as well as adhesive layer thickness, and we further obtain the failure strength surface, interfacial fracture energy, as well as the energy release rate for the bonding system. The obtained results can provide a scientific basis for deeply understanding the strength and toughness properties as well as the failure mechanism of the metal-adhesive bonding system, and have an important guidance on optimization design and property evolution of the bonding system.

Novel metal-carbonyl-metal bonding system. Synthesis and stereochemistry of Al[W(CO)3C5H5]3(C4H8O)3

1971 ◽  
Vol 93 (14) ◽  
pp. 3532-3533 ◽  
Author(s):  
James M. Burlitch ◽  
Robert B. Petersen ◽  
John J. Stezowski ◽  
Che'ng Wan ◽  
R. E. Hughes
Keyword(s):  
Metal Carbonyl ◽  
System Synthesis ◽  
Metal Bonding ◽  
Bonding System

Mechanical–Microstructure Relationship and Cellular Failure Mechanism of Silicone Rubber Foam by the Cell Microstructure Designed in Supercritical CO2

2019 ◽  
Vol 123 (44) ◽  
pp. 26947-26956 ◽  
Author(s):  
Wanyu Tang ◽  
Xia Liao ◽  
Yuan Zhang ◽  
Junsong Li ◽  
Gui Wang ◽  
...  
Keyword(s):  
Failure Mechanism ◽  
Silicone Rubber ◽  
Supercritical Co2

Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers

2006 ◽  
Vol 970 ◽  
Author(s):  
Ronald J. Gutmann ◽  
J. Jay McMahon ◽  
Jian-Qiang Lu
Keyword(s):  
Bonding Strength ◽  
Adhesive Bonding ◽  
Process Integration ◽  
Three Dimensional ◽  
Adhesive Layer ◽  
Wafer Level ◽  
Technology Platform ◽  
Metal Bonding ◽  
Wafer Level Packaging ◽  
Metal Metal

ABSTRACTA monolithic, wafer-level three-dimensional (3D) technology platform is described that is compatible with next-generation wafer level packaging (WLP) processes. The platform combines the advantages of both (1) high bonding strength and adaptability to IC wafer topography variations with spin-on dielectric adhesive bonding and (2) process integration and via-area advantages of metal-metal bonding. A copper-benzocyclobutene (Cu-BCB) process is described that incorporates single-level damascene-patterned Cu vias with partially-cured BCB as the bonding adhesive layer. A demonstration vehicle consisting of a two-wafer stack of 2-4 μm diameter vias has shown the bondability of both Cu-to-Cu and BCB-to-BCB. Planarization conditions to achieve BCB-BCB bonding with low-resistance Cu-Cu contacts have been examined, with wafer-scale planarization requirements compared to other 3D platforms. Concerns about stress induced at the tantalum (Ta) liner-to-BCB interface resulting in partial delamination are discussed. While across-wafer uniformity has not been demonstrated, the viability of this WLP-compatible 3D platform has been shown.

Experimental determination of impact tensile properties of adhesive butt joints with the split Hopkinson bar

2003 ◽  
Vol 38 (3) ◽  
pp. 233-245 ◽  
Author(s):  
T Yokoyama
Keyword(s):  
Tensile Strength ◽  
Layer Thickness ◽  
Energy Absorption ◽  
Loading Rate ◽  
Adhesive Layer ◽  
Hopkinson Bar ◽  
Butt Joints ◽  
Cyanoacrylate Adhesive ◽  
Split Hopkinson ◽  
The Impact

The tensile strength and energy absorption of adhesive butt joints at high rates of loading are determined with a tensile split Hopkinson bar using a cylindrical specimen. A commercially available single-component cyanoacrylate adhesive (instantaneous adhesive) and two different adherend materials are used in the adhesion tests. The impact tensile strength of the cyanoacrylate adhesive butt joints is determined from the applied tensile stress history at failure initiation. The impact absorbed energy is obtained by numerical integration of dynamic tensile load-adhesive deformation data. Comparative tension tests at low and intermediate rates of loading are performed on an Instron testing machine. An axisymmetric finite element analysis is carried out to investigate the stress distributions in the adhesive layer of the cyanoacrylate adhesive butt joints. The effects of loading rate, adherend material and adhesive layer thickness on the tensile strength and energy absorption of the cyanoacrylate adhesive butt joints are examined in detail. It is shown that the joint tensile strength increases significantly with increasing loading rate and is greatly affected by both the adhesive layer thickness and the adherend materials. The limitations of the technique are discussed.

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