Development of hybrid method coupling moire interferometry and finite element analysis

1996 ◽  
Vol 60 (3) ◽  
pp. 433-440 ◽  
Author(s):  
G.Jayarama Rao ◽  
P. Rathinam ◽  
R. Narayanan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Hybrid Method ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Element Analysis

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

2003 ◽  
Vol 125 (2) ◽  
pp. 282-288 ◽  
Author(s):  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Real Time ◽  
Room Temperature ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Wafer Level ◽  
Element Analysis ◽  
The Real ◽  
Thermal Chamber

In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire´ interferometry. One is a thermal load from 100°C to room temperature and the other is from room temperature to 100°C. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical window was developed. In addition, the test results obtained from the moire´ interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests.

scholarly journals Efficient analysis of welding thermal conduction using the Newton–Raphson method, implicit method, and their combination

2020 ◽  
Vol 111 (7-8) ◽  
pp. 1929-1940 ◽  
Author(s):  
Zhongyuan Feng ◽  
Ninshu Ma ◽  
Wangnan Li ◽  
Kunio Narasaki ◽  
Fenggui Lu
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Hybrid Method ◽  
Thermal Conduction ◽  
Computing Time ◽  
Implicit Method ◽  
Heating Process ◽  
Element Analysis ◽  
Heating And Cooling ◽  
Raphson Method

AbstractFinite element analysis is commonly used to investigate the thermal-mechanical phenomena during welding. To improve the computing efficiency of finite element analysis for welding thermal conduction, a novel Newton–Raphson method (NRM) without the computation of inverse matrix and a hybrid method combing the NRM and conventional implicit method (IMP) were developed. Comparison of computing time between the hybrid method implemented in an in-house software JWRIAN and the IMP used in a commercial software ABAQUS indicated that the computing speed of the former was about 4.5 times faster than that of the latter. Additionally, compared to the conventional IMP, the NRM exhibited higher computing efficiency in the analysis of transient thermal conduction during the welding heating process. Meanwhile, a combined hybrid method of the NRM and IMP was verified to be more efficient in analyzing the welding thermal conduction throughout the heating and cooling processes. Moreover, the thermal cycles computed by the hybrid method were consistent with those from experimental measurement, indicating the high accuracy of the hybrid method. Furthermore, the hybrid method was used to predict the temperature field of the corner boxing fillet joint welded by a low transformation temperature weld metal for generation of compressive residual stress.

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

1998 ◽  
Vol 120 (2) ◽  
pp. 179-185 ◽  
Author(s):  
J. Wang ◽  
Z. Qian ◽  
D. Zou ◽  
S. Liu
Keyword(s):  
Finite Element ◽  
Creep Behavior ◽  
Thermal Load ◽  
Flip Chip ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Initial State ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Solder Balls

In this paper, the creep behavior of a flip-chip package under a thermal load was investigated by using nonlinear finite element technique coupled with high density laser moire´ interferometry. The real-time moire´ interferometry technique was used to monitor and measure the time-dependent deformation of flip-chip packages during the test, while the finite element method was adapted to analyze the variation of stresses at edges and corners of interfaces with time by considering the viscoelastic properties of the underfill and the viscoplastic behavior of the solder balls. The results show that the creep behavior of the underfill and the solder balls does not have significant effect on the warpage of the flip-chip under the considered thermal load due to their constrained small volume. The variation of the time-dependent deformation in the flip-chip package caused by the creep behavior of the underfill and the solder balls is in the submicro scale. The maximum steady-state U-displacement is only reduced by up to 6.7 percent compared with the maximum initial state U-displacement. Likewise, the maximum steady-state V-displacement is merely reduced by up to 10 percent compared with the maximum initial state V-displacement. The creep behavior slightly weakens the warpage situation of the flip-chip package. However, the modeling results show that the localized stresses at corners and edges of interfaces greatly decrease due to the consideration of viscoelastic properties of the underfill and the viscoplastic properties of the solder balls, and, thereby, effectively preventing interfaces from cracking. In addition, the predicted deformation values of the flip-chip package obtained from the finite element analysis were compared with the test data obtained from the laser moire´ interferometry technique. It is shown that the deformation values of the flip-chip package predicted from the finite element analysis are in a fair agreement with those obtained from the test.

A powerful hybrid method in finite element analysis

1971 ◽  
Vol 3 (3) ◽  
pp. 389-403 ◽  
Author(s):  
A. K. Rao ◽  
I. S. Raju ◽  
A. V. Krishna Murty
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Hybrid Method ◽  
Element Analysis

A New Hybrid Method for Mid-Frequency Vibration of Beam-Plate System Under External Point Loading

2013 ◽  
Author(s):  
Danhui Zhu ◽  
Hualing Chen ◽  
Xiangjie Kong ◽  
Wenbo Zhang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Hybrid Method ◽  
High Frequency ◽  
Power Flow ◽  
Vibrational Energy ◽  
Element Analysis ◽  
External Point ◽  
Reverberant Field ◽  
Plate System

In this paper, a new hybrid method combining finite element analysis (FEA) and energy finite element analysis (EFEA) is developed for predicting the vibrational response of beam-plate system in mid-frequency range, which enables the local detailed response of the system to be obtained. The waves produced in the system exhibit low- and high-frequency vibrational characteristics simultaneously, which are called stiff member and flexible member separately. The former is modeled using classical FEA, meanwhile the latter is simulated by EFEA. However, unlike classical EFEA, the vibrational energy is considered as the superposition of the direct field and the reverberant field associating the mechanism of wave propagation in high-frequency. Furthermore, the power transfer between two fields is considered according to the transferring pathway analysis of power flow, which is more accurate than the traditional EFEA at the driving points and boundaries. Additionally, the compatibility of the stiff and flexible members is formulated in a global matrix of the system, in which the interactions between these two members are captured. The new developments are validated by a beam-plate system with a line junction under an external point loading applied on the beam, and good correlations are found when compared with the results from very dense classical FEA model.

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