Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

2003 ◽  
Vol 125 (2) ◽  
pp. 282-288 ◽  
Author(s):  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Real Time ◽  
Room Temperature ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Wafer Level ◽  
Element Analysis ◽  
The Real ◽  
Thermal Chamber

In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire´ interferometry. One is a thermal load from 100°C to room temperature and the other is from room temperature to 100°C. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical window was developed. In addition, the test results obtained from the moire´ interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests.

scholarly journals Real-time finite element analysis allows homogenization of tissue scale strains and reduces variance in a mouse defect healing model

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Graeme R. Paul ◽  
Esther Wehrle ◽  
Duncan C. Tourolle ◽  
Gisela A. Kuhn ◽  
Ralph Müller
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fracture Healing ◽  
Real Time ◽  
Mechanical Stimulus ◽  
Stimulus Level ◽  
Micro Computed Tomography ◽  
Reference Distribution ◽  
Element Analysis ◽  
Computed Tomography Images

AbstractMechanical loading allows both investigation into the mechano-regulation of fracture healing as well as interventions to improve fracture-healing outcomes such as delayed healing or non-unions. However, loading is seldom individualised or even targeted to an effective mechanical stimulus level within the bone tissue. In this study, we use micro-finite element analysis to demonstrate the result of using a constant loading assumption for all mouse femurs in a given group. We then contrast this with the application of an adaptive loading approach, denoted real time Finite Element adaptation, in which micro-computed tomography images provide the basis for micro-FE based simulations and the resulting strains are manipulated and targeted to a reference distribution. Using this approach, we demonstrate that individualised femoral loading leads to a better-specified strain distribution and lower variance in tissue mechanical stimulus across all mice, both longitudinally and cross-sectionally, while making sure that no overloading is occurring leading to refracture of the femur bones.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Finite Element Simulating of C/SiC Composite Bolt

2012 ◽  
Vol 268-270 ◽  
pp. 3-6
Author(s):  
Tao Huang ◽  
Yi Yan Zhang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Elevated Temperature ◽  
Room Temperature ◽  
Engineering Application ◽  
Contact Friction ◽  
Element Analysis ◽  
Valuable Data ◽  
The Finite Element Analysis ◽  
Sic Composites

A numerical investigation was conducted to determine the mechanical behavior of C/SiC composites bolt under room temperature and elevated temperature. The influence of the contact friction coefficient on the stress and displacement was considered in the finite element analysis. The FEA results provided some valuable data for the engineering application of C/SiC composites bolt.

Comparing Study on Real Drawbead and Equivalent Drawbead Based on Finite Element Analysis

2012 ◽  
Vol 430-432 ◽  
pp. 1056-1059
Author(s):  
Xiao Gang Qiu ◽  
Hao Huang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Deformation Behavior ◽  
Fe Simulation ◽  
Element Analysis ◽  
Explicit Finite Element ◽  
The Real ◽  
Finite Element Software ◽  
Simulation Results ◽  
Virtual Velocity

The dynamic explicit finite element software DYNAFORM was used to simulate the real and equivalent drawbead model. Analyzed the influence of the blank hold force (BHF) and virtual velocity on blank’s deformation behavior after passing through drawbead, compared the results of the FE simulation. The simulation results were confirmed by experiments. The study shows that the equivalent drawbead model can’t simulate the blank’s behavior precisely when it passing the real drawbeads, the effect of BHF on real drawbead model is larger than equal drawbead model; the proper range of virtual velocity was obtained at the same time.

scholarly journals Reducing variance in a mouse defect healing model: Real-time Finite Element Analysis allows homogenization of tissue scale strains

2020 ◽  
Author(s):  
Graeme R. Paul ◽  
Esther Wehrle ◽  
Duncan C. Tourolle ◽  
Gisela A. Kuhn ◽  
Ralph Müller
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fracture Healing ◽  
Real Time ◽  
Mechanical Stimulus ◽  
Stimulus Level ◽  
Micro Computed Tomography ◽  
Reference Distribution ◽  
Element Analysis ◽  
Computed Tomography Images

AbstractMechanical loading allows both investigation into the mechano-regulation of fracture healing as well as interventions to improve fracture-healing outcomes such as delayed healing or non-unions. However, loading is seldom individualised or even targeted to an effective mechanical stimulus level within the bone tissue. In this study, we use micro-finite element analysis to demonstrate the result of using a constant loading assumption for all mouse femurs in a given group. We then contrast this with the application of an adaptive loading approach, denoted real time Finite Element (rtFE) adaptation, in which micro-computed tomography images provide the basis for micro-FE based simulations and the resulting strains are manipulated and targeted to a reference distribution. Using this approach, we demonstrate that individualised femoral loading leads to a better-specified strain distribution and lower variance in tissue mechanical stimulus across all mice, both longitudinally and cross-sectionally, while making sure that no overloading is occurring leading to refracture of the femur bones.

Integration of Realtime Finite Element Analysis and Haptic Feedback for Hands-On Learning of the Mechanical Behavior of Materials

2013 ◽  
Author(s):  
Francesco Ferrise ◽  
Monica Bordegoni ◽  
Michele Fiorentino ◽  
Antonio E. Uva
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Mechanical Behavior ◽  
Real Time ◽  
Haptic Feedback ◽  
Element Analysis ◽  
Hands On ◽  
Hands On Learning ◽  
Displacement Constraints ◽  
Color Map

The paper describes a novel application of real-time finite element analysis controlled by a haptic device. The user can impose displacement constraints to a virtual structure using a probe and sense in real-time the response in terms of forces on her/his hand. In addition, conventional color map results are visualized on a desktop monitor. The application has been developed with the aim of simplifying the teaching of the mechanical behavior of materials in engineering schools by transforming the learning phase into an enactive process. A set of examples commonly used in the mechanical engineering courses have been implemented and tested. The paper describes and discusses the system implementation, the potentialities and the issues of such approach.

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