Combination of a focused ion beam system and a scanning electron microscope for in situ observation of ion beam effects

1989 ◽  
Vol 31 (4) ◽  
pp. 484
Author(s):  
L. Vijgen ◽  
E.J.M. v. Welsy
2013 ◽  
Vol 183 (1) ◽  
pp. 11-18 ◽  
Author(s):  
D.A. Matthijs de Winter ◽  
Rob J. Mesman ◽  
Michael F. Hayles ◽  
Chris T.W.M. Schneijdenberg ◽  
Cliff Mathisen ◽  
...  

2006 ◽  
Vol 983 ◽  
Author(s):  
Xuefeng Wang ◽  
Chang Liu

AbstractWe report recent development of a three-probe micromachined nanomanipulator for manipulation and in-situ characterization of nanomaterials in scanning electron microscope (SEM). The nanomanipulator consists of three independent probes having thermal bimetallic actuators and nanoscopic end-effectors. Nanoscale end-effectors with sub-100-nm spacing are created using focused ion beam (FIB) milling to directly interface with nanoscopic objects (e.g., nanotubes, nanowires). Handling of individual carbon nanotubes (CNTs) was successfully realized with the nanomanipulator in an SEM.


2017 ◽  
Vol 79 ◽  
pp. 314-320 ◽  
Author(s):  
Renuka Vallabhaneni ◽  
Ehsan Izadi ◽  
Carl R. Mayer ◽  
C. Shashank Kaira ◽  
Sudhanshu S. Singh ◽  
...  

Author(s):  
Becky Holdford

Abstract On mechanically polished cross-sections, getting a surface adequate for high-resolution imaging is sometimes beyond the analyst’s ability, due to material smearing, chipping, polishing media chemical attack, etc.. A method has been developed to enable the focused ion beam (FIB) to re-face the section block and achieve a surface that can be imaged at high resolution in the scanning electron microscope (SEM).


Author(s):  
Julien Goxe ◽  
Béatrice Vanhuffel ◽  
Marie Castignolles ◽  
Thomas Zirilli

Abstract Passive Voltage Contrast (PVC) in a Scanning Electron Microscope (SEM) or a Focused Ion Beam (FIB) is a key Failure Analysis (FA) technique to highlight a leaky gate. The introduction of Silicon On Insulator (SOI) substrate in our recent automotive analog mixed-signal technology highlighted a new challenge: the Bottom Oxide (BOX) layer, by isolating the Silicon Active Area from the bulk made PVC technique less effective in finding leaky MOSFET gates. A solution involving sample preparation performed with standard FA toolset is proposed to enhance PVC on SOI substrate.


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