Spatial structure of solid-liquid interface near melting temperature

1992 ◽  
Vol 189 (3-4) ◽  
pp. 478-492
Author(s):  
V.A. Stephanovich ◽  
A. Ferraz
2005 ◽  
Vol 486-487 ◽  
pp. 460-463 ◽  
Author(s):  
Chang Yong Jo ◽  
D.H. Kim ◽  
Yeong Seok Yoo ◽  
D.H. Ye ◽  
Jung Hun Lee

Carbon and boron were mainly considered to strengthen grain boundaries formed during single crystal casting of complex shaped components. However, those elements cause segregation forming the phase with low melting temperature or with brittle nature. To determine the optimum amount of these elements, the effect of boron on solidification behavior was investigated in the C doped single crystal RR 2072 alloy. The solid/liquid interface morphologies and the solidification microstructures were studied at various solidification rates and with B addition by directional solidification.


2020 ◽  
Vol 124 (5) ◽  
pp. 2987-2993
Author(s):  
Chi-Kuang Sun ◽  
Yi-Ting Yao ◽  
Chih-Chiang Shen ◽  
Mu-Han Ho ◽  
Tien-Chang Lu ◽  
...  

2021 ◽  
Author(s):  
Wei Zhang ◽  
Qiang Wu ◽  
Ziqi Zeng ◽  
Chuang Yu ◽  
Shijie Cheng ◽  
...  

A soluble organoselenide compound, phenyl diselenide (PDSe), is employed as a soluble electrolyte additive to enhance the kinetics of sulfurized polyacrylonitrile cathode, in which radical exchange in the solid-liquid interface...


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