Laser soldering and inspection of fine pitch electronic components

1996 ◽  
Vol 56 (1-4) ◽  
pp. 531-541 ◽  
Author(s):  
A. Flanagan ◽  
A. Conneely ◽  
T.J. Glynn ◽  
G. Lowe
Keyword(s):  
Electronic Components ◽  
Fine Pitch ◽  
Laser Soldering

scholarly journals Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3353
Author(s):  
Marina Makrygianni ◽  
Filimon Zacharatos ◽  
Kostas Andritsos ◽  
Ioannis Theodorakos ◽  
Dimitris Reppas ◽  
...  
Keyword(s):  
High Resolution ◽  
Form Factors ◽  
Circuit Board ◽  
Lead Free ◽  
Process Conditions ◽  
Solder Paste ◽  
Electronic Components ◽  
Successful Operation ◽  
Fine Pitch ◽  
Forward Transfer

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (3rd Report)

1994 ◽  
Vol 60 (12) ◽  
pp. 1806-1810 ◽  
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Masaharu YOSHIDA ◽  
Osamu HAYASHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

Optimizing technological process for laser soldering of fine-pitch flip chips

2009 ◽  
Author(s):  
Reka Batorfi ◽  
Zsolt Illyefalvi-Vitez ◽  
Oliver Krammer ◽  
Radu Bunea ◽  
Paul Svasta
Keyword(s):  
Technological Process ◽  
Flip Chips ◽  
Fine Pitch ◽  
Laser Soldering

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock. These electronic components may get exposed to high strain rates of 1 to 100 s−1 and operating temperatures up to 200 °C in critical surroundings. Doped SAC solder alloys such as SAC-Q are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). Prior data presented to date for lead-free solders, such as SAC-Q alloy, at high aging temperature and high strain rate are for 50 °C sustained exposure. In this paper, the effect of sustained exposure to temperature of 100 °C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100 °C have been tested at a range of strain rates including 10, 35, 50, and 75 s−1 and operating temperatures ranging from 25 °C up to 200 °C. Stress–strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fitted to the Anand viscoplasticity model for SAC-Q for comparison.

Laser soldering for fine-pitch leads in SMT assembly

1994 ◽  
Author(s):  
Kohei Murakami ◽  
Akira Adachi ◽  
Yoshiyuki Morihiro ◽  
Susumu Hoshinouchi
Keyword(s):  
Fine Pitch ◽  
Laser Soldering

Aerosol-Jet Printing for Functionalization of Prototyping Materials for Electronic Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000741-000748 ◽  
Author(s):  
Johannes Hörber ◽  
Christian Goth ◽  
Jörg Franke
Keyword(s):  
Focal Length ◽  
Powder Materials ◽  
Electronic Components ◽  
Powder Bed ◽  
Fine Pitch ◽  
Jet Printing ◽  
Aerosol Jet Printing ◽  
Molded Interconnect Devices

To meet the growing demand for adapted 3D electronic devices, e. g. for customized electronic components as well as for Molded Interconnect Devices in small batches, 3D aerosol-jet printing combined with widely-used rapid prototyping methods like stereolithography and powder bed based printing is investigated. Compared to other printing methods for fine pitch structures, the innovative contact- and maskless aerosol-jetting is advantageous for structuring of spatial substrates. This is due to the large viscosity range of processible inks, a flexible stand-off between substrate and nozzle as well as the focal length of the aerosol beam. Focus of the printing tests on stereolithography materials presented in the paper is the suitability of the nanoparticle silver inks (solvent: water and ethylene glycol, respectively) for additive manufacturing of conductor tracks concerning adhesiveness, conductivity and wettability, which can be improved by plasma treatment. Furthermore, test specimens were assembled by mounting of electronic components using isotropic conductive adhesive. Long term reliability tests of these specimens (thermal cycling at −40 °C/+125 °C; temperature humidity test 85 °C/85 % r. h.) were performed in respect of conductivity of circuit tracks and quality of the adhesive joints. Compared to stereolithography materials aerosol-jet printing on powder bed materials requires adapted processing for functionalization. Due to the rough and porous surface and the low thermal stability of the PMMA powder materials, selective sintering of silver tracks by light was examined as well as printing on PU infiltrated surfaces. Despite of reduced contour definition, good conductivity was achieved.

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments may often be exposed to elevated temperature for the duration of storage, process and usage in addition to high strain rate triggering loads during drop-impact, vibration and shock. These electronic components may get exposed to high strain rates of 1 to 100 per seconds and operating temperature up to 200°C in the critical surroundings. SAC solder alloys (e.g. SAC-Q (CYCLOMAX), and Innolot) are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). The data presented till date for lead-free solders like SAC-Q alloy at high aging temperature and at high strain rate are for 50°C sustained exposure. In this paper, effect of sustained exposure of 100°C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100°C have been tested at a range of strain rates including 10, 35, 50, and 75 per second and operating temperatures starting from 25°C up to 200°C. Stress-strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fit to the Anand Viscoplasticity model for SAC-Q for comparison.

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (2nd Report)

1994 ◽  
Vol 60 (5) ◽  
pp. 713-717 ◽  
Author(s):  
Kohei MIJRAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Osamu HAYASHI ◽  
Susumu HOSHINOUCHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

scholarly journals Development of a rectangular dual-beam optical unit for YAG laser soldering of fine pitch flat package IC's.

1989 ◽  
Vol 17 (7) ◽  
pp. 469-477 ◽  
Author(s):  
Hiroshi MIURA ◽  
Kazumi ISHIKAWA ◽  
Keiji OKINO
Keyword(s):  
Yag Laser ◽  
Fine Pitch ◽  
Dual Beam ◽  
Laser Soldering ◽  
Optical Unit
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