High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments may often be exposed to elevated temperature for the duration of storage, process and usage in addition to high strain rate triggering loads during drop-impact, vibration and shock. These electronic components may get exposed to high strain rates of 1 to 100 per seconds and operating temperature up to 200°C in the critical surroundings. SAC solder alloys (e.g. SAC-Q (CYCLOMAX), and Innolot) are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). The data presented till date for lead-free solders like SAC-Q alloy at high aging temperature and at high strain rate are for 50°C sustained exposure. In this paper, effect of sustained exposure of 100°C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100°C have been tested at a range of strain rates including 10, 35, 50, and 75 per second and operating temperatures starting from 25°C up to 200°C. Stress-strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fit to the Anand Viscoplasticity model for SAC-Q for comparison.

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock. These electronic components may get exposed to high strain rates of 1 to 100 s−1 and operating temperatures up to 200 °C in critical surroundings. Doped SAC solder alloys such as SAC-Q are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). Prior data presented to date for lead-free solders, such as SAC-Q alloy, at high aging temperature and high strain rate are for 50 °C sustained exposure. In this paper, the effect of sustained exposure to temperature of 100 °C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100 °C have been tested at a range of strain rates including 10, 35, 50, and 75 s−1 and operating temperatures ranging from 25 °C up to 200 °C. Stress–strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fitted to the Anand viscoplasticity model for SAC-Q for comparison.

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye ◽  
Sandeep Shantaram ◽  
Jeff Suhling
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
Isothermal Aging ◽  
High Strain ◽  
Image Correlation ◽  
Lead Free ◽  
Strain Rates ◽  
Full Field

Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a road-block in the migration to Pb-free. Multiple compositions with additives to SAC have been proposed to minimize the effect of aging and creep while maintaining the melting temperatures, strength and cost at par with SAC. Innolot is a newly developed high-temperature, high-performance lead-free substitute by InnoRel™ targeting the automotive electronics segment. Innolot contains Nickel (Ni), Antimony (Sb) and Bismuth (Bi) in small proportions in addition to Sn, Ag and Cu. The alloy has demonstrated enhanced reliability under thermal cycling as compared to SAC alloys. In this paper, the high strain rate material properties of Innolot have been evaluated as the alloy ages at an elevated temperature of 50°C. The strain rates chosen are in the range of 1–100 per-second which are typical at second level interconnects subjected to drop-shock environments. The strain rates and elevated aging temperature have been chosen also to correspond to prior tests conducted on SAC105 and SAC305 alloys at this research center. This paper presents a comparison of material properties and their degradation in the three alloys — SAC105, SAC305 and Innolot. Full field strain measurements have been accomplished with the use of high speed imaging in conjunction with Digital Image Correlation (DIC). Ramberg-Osgood non-linear model parameters have been determined to curve-fit through the experimental data. The parameters have been implemented in Abaqus FE model to obtain full-field stresses which correlates with contours obtained experimentally by DIC.

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Lead Free ◽  
Electronic Systems ◽  
Strain Rates ◽  
High Strain Rates ◽  
Solder Interconnects

Electronics products may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact. Electronics subjected to drop-impact, shock and vibration may experience strain rates of 1–100 per sec. There are no material properties available in published literature at high strain rate at elevated temperature. High temperature and vibrations can contribute to the failures of electronic system. The reliability of electronic products can be improved through a thorough understanding of the weakest link in the electronic systems which is the solder interconnects. The solder interconnects accrue damage much faster when subjected to Shock and vibration at elevated temperatures. There is lack of fundamental understanding of reliability of electronic systems subjected to thermal loads. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. Extended period of thermal aging has been shown to affect the mechanical properties of lead free alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Previously, the microstructure, mechanical response and failure behavior of leadfree solder alloys when subjected to elevated isothermal aging and/or thermal cycling [Darveaux 2005, Ding 2007, Pang 2004] have been measured. Pang [1998] has showed that young’s modulus and yield stress of Sn-Pb are highly depending on strain rate and temperature. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. Previously, Mechanical properties of lead-free alloys, at different high strain rates (10, 35, 50, 75 /sec) and elevated temperature (25 C-125 C) for pristine samples have been studied [Lall 2012 and Lall 2014]. Previous researchers [Suh 2007 and Jenq 2009] have determined the mechanical properties of SAC105 at very high strain rate (Above 1000 per sec) using compression testing. But there is no data available in published literature at high strain rate and at elevated temperature for aged conditions. In this study, mechanical properties of lead free SAC105 has been determined for high strain rate at elevated temperature for aged samples. Effect of aging on mechanical properties of SAC105 alloy a high strain rates has been studied. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for aged specimen. Experimental data for the aged specimen has been fit to the ANAND’s viscoplastic model. SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. The test samples were exposed to isothermal aging conditions at 50°C for different aging time (30, 60, and 120 Days) before testing. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity.

Impact tensile behavior and frequency response of 3D braided composites

2011 ◽  
Vol 82 (3) ◽  
pp. 280-287 ◽  
Author(s):  
Xuehui Gan ◽  
Jianhua Yan ◽  
Bohong Gu ◽  
Baozhong Sun
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Tensile Properties ◽  
High Strain ◽  
Tensile Modulus ◽  
Tensile Failure ◽  
Uniaxial Tensile ◽  
Strain Rates ◽  
Braided Composites ◽  
3D Braided Composites

The uniaxial tensile properties of 4-step 3D braided E-glass/epoxy composites under quasi-static and high-strain rate loadings have been investigated to evaluate the tensile failure mode at different strain rates. The uniaxial tensile properties at high strain rates from 800/s to 2100/s were tested using the split Hopkinson tension bar (SHTB) technique. The tensile properties at quasi-static strain rate were also tested and compared with those in high strain rates. Z-transform theory is applied to 3D braided composites to characterize the system dynamic behaviors in frequency domain. The frequency responses and the stability of 3D braided composites under quasi-static and high-strain rate compression have been analyzed and discussed in the Z-transform domain. The results indicate that the stress-strain curves are rate sensitive, and tensile modulus, maximum tensile stress and corresponding tensile strain are also sensitive to the strain rate. The tensile modulus, maximum tensile stress of the 3D braided composites are linearly increased with the strain rate. With increasing of the strain rate (from 0.001/s to 2100/s), the tensile failure of the 3D braided composite specimens has a tendency of transition from ductile failure to brittle failure. The magnitude response and phase response is very different in quasi-static loading with that in high-strain rate loading. The 3D braided composite system is more stable at high strain rate than quasi-static loading.

Research on Numerical Algorithm of Constitutive Equation under High Speed Deformation in Hadfield Steel

2012 ◽  
Vol 562-564 ◽  
pp. 688-692 ◽  
Author(s):  
Deng Yue Sun ◽  
Jing Li ◽  
Fu Cheng Zhang ◽  
Feng Chao Liu ◽  
Ming Zhang
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Deformation Behavior ◽  
High Speed ◽  
High Strain ◽  
Equivalent Stress ◽  
Hadfield Steel ◽  
Stress And Strain ◽  
Strain Rates ◽  
The Finite Element Method

The influence of the strain rate on the plastic deformation of the metals was significant during the high strain rate of loading. However, it was very difficult to obtain high strain rate data (≥ 104 s-1) by experimental techniques. Therefore, the finite element method and iterative method were employed in this study. Numerical simulation was used to characterise the deformation behavior of Hadfield steel during explosion treatment. Base on experimental data, a modified Johnson-Cook equation for Hadfield steel under various strain rate was fitted. The development of two field variables was quantified during explosion hardening: equivalent stress and strain rates.

Numerical Simulation of Hot High Strain Rate Torsion Tests for Al-Based Alloys

2019 ◽  
Vol 822 ◽  
pp. 66-71
Author(s):  
Anton Naumov ◽  
Anatolii Borisov ◽  
Anastasiya Y. Doroshchenkova
Keyword(s):  
Numerical Simulation ◽  
High Strain Rate ◽  
Strain Rate ◽  
Visual Analysis ◽  
Physical Simulation ◽  
High Strain ◽  
Torsion Test ◽  
Strain Rates ◽  
Deform 3D

The present research describes the comparison of numerical and physical simulation of hot high strain rate torsion tests for Al-based alloys in order to clarify the accuracy of calculations using basic grades of materials in Deform-3DTM software. A comparative visual analysis of the results is presented. Obtained data on the distribution of temperatures, strains, stresses and strain rates during the torsion test are discussed.

High Strain Rate Blow Formability of Newly Developed Al-Mg-High-Mn Alloy

2012 ◽  
Vol 735 ◽  
pp. 271-277 ◽  
Author(s):  
Tomoyuki Kudo ◽  
Akira Goto ◽  
Kazuya Saito
Keyword(s):  
Grain Size ◽  
High Strain Rate ◽  
Strain Rate ◽  
Mass Production ◽  
High Strain ◽  
Mg Alloy ◽  
Strain Rates ◽  
Fine Grain ◽  
Aa5083 Alloy ◽  
Complex Parts

Blow forming accompanied with superplasticity makes possible the forming of complex parts, which cannot be formed by cold press forming. The conventional superplastic AA5083 alloy ‘ALNOVI-1’ developed by the Furukawa-Sky Aluminum Corp. shows high superplasticity because of its fine grain and is widely used for blow forming. However, for mass production of components, an Al-Mg alloy with finer-sized grains is needed. In this research, the newly developed high Mn version of the Al-Mg alloy ‘ALNOVI-U’ is used, and this material possesses grains finer than those of the conventional AA5083 alloy. The effects of finer grain size on the blow formability at high strain rates over 10-2/s and the properties of the resulting moldings were studied.

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

scholarly journals Effect of Stress-Relieving Heat Treatment on the High Strain Rate Dynamic Compressive Properties of Additively Manufactured Ti6Al4V (ELI)

Metals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 653
Author(s):  
Amos Muiruri ◽  
Maina Maringa ◽  
Willie du Preez ◽  
Leonard Masu
Keyword(s):  
Plastic Strain ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Split Hopkinson Pressure Bar ◽  
Deformation Behaviour ◽  
Test System ◽  
Strain Rates ◽  
Stress Relieving ◽  
Strain Rate Compression

A study was undertaken on the compressive high strain rate properties and deformation behaviour of Direct Metal Laser-Sintered (DMLS) Ti6Al4V (ELI) parts in two separate forms: as-built (AB) and stress relieved (SR). The high strain rate compression tests were carried out using a Split Hopkinson Pressure Bar test system at ambient temperature. The average plastic strain rates attained by the system were 400 s−1 and 700 s−1. Comparative analyses of the performance (flow stresses and fracture strains) of AB and SR specimens were carried out based on the results obtained at these two plastic strain rates. Microstructural analyses were performed to study the failure mechanisms of the deformed specimens and fracture surfaces. Vickers microhardness test values were obtained before and after high strain rate compression testing. The results obtained in both cases showed the strain rate sensitivity of the stress-relieved samples to be higher in comparison to those of as-built ones, at the same value of true strain.

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