scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (3rd Report)

1994 ◽  
Vol 60 (12) ◽  
pp. 1806-1810 ◽  
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Masaharu YOSHIDA ◽  
Osamu HAYASHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (2nd Report)

1994 ◽  
Vol 60 (5) ◽  
pp. 713-717 ◽  
Author(s):  
Kohei MIJRAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Osamu HAYASHI ◽  
Susumu HOSHINOUCHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (1st Report)

1993 ◽  
Vol 59 (9) ◽  
pp. 1513-1518
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Osamu HAYASHI ◽  
Susumu HOSHINOUCHI
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

Development of laser soldering process for a tape carrier package

2003 ◽  
Author(s):  
M. Namatame ◽  
K. Murakami ◽  
J. Hirota ◽  
O. Hayashi ◽  
S. Hoshinouchi
Keyword(s):  
Soldering Process ◽  
Laser Soldering

scholarly journals Head-on-Pillow Defect Detection: X-Ray Inspection Limitations

2019 ◽  
Vol 16 (2) ◽  
pp. 91-102
Author(s):  
Lars Bruno ◽  
Benny Gustafson
Keyword(s):  
Solder Joints ◽  
Solder Paste ◽  
Wafer Level ◽  
Reflow Soldering ◽  
X Ray ◽  
Soldering Process ◽  
Irregular Shapes ◽  
Fine Pitch ◽  
Solder Balls ◽  
Ball Grid Array Packages

Abstract Both the number and the variants of ball grid array packages (BGAs) are tending to increase on network printed board assemblies with sizes ranging from a few millimeter die size wafer level packages with low ball count to large multidie system-in-package (SiP) BGAs with 60–70 mm side lengths and thousands of I/Os. One big challenge, especially for large BGAs, SiPs, and for thin fine-pitch BGA assemblies, is the dynamic warpage during the reflow soldering process. This warpage could lead to solder balls losing contact with the solder paste and its flux during parts of the soldering process, and this may result in solder joints with irregular shapes, indicating poor or no coalescence between the added solder and the BGA balls. This defect is called head-on-pillow (HoP) and is a failure type that is difficult to determine. In this study, x-ray inspection was used as a first step to find deliberately induced HoP defects, followed by prying off of the BGAs to verify real HoP defects and the fault detection correlation between the two methods. The result clearly shows that many of the solder joints classified as potential HoP defects in the x-ray analysis have no evidence at all of HoP after pry-off. This illustrates the difficulty of determining where to draw the line between pass and fail for HoP defects when using x-ray inspection.

Optimizing technological process for laser soldering of fine-pitch flip chips

2009 ◽  
Author(s):  
Reka Batorfi ◽  
Zsolt Illyefalvi-Vitez ◽  
Oliver Krammer ◽  
Radu Bunea ◽  
Paul Svasta
Keyword(s):  
Technological Process ◽  
Flip Chips ◽  
Fine Pitch ◽  
Laser Soldering

Laser soldering for fine-pitch leads in SMT assembly

1994 ◽  
Author(s):  
Kohei Murakami ◽  
Akira Adachi ◽  
Yoshiyuki Morihiro ◽  
Susumu Hoshinouchi
Keyword(s):  
Fine Pitch ◽  
Laser Soldering

Laser soldering and inspection of fine pitch electronic components

1996 ◽  
Vol 56 (1-4) ◽  
pp. 531-541 ◽  
Author(s):  
A. Flanagan ◽  
A. Conneely ◽  
T.J. Glynn ◽  
G. Lowe
Keyword(s):  
Electronic Components ◽  
Fine Pitch ◽  
Laser Soldering
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