Microstructure development and morphological transition during deposition of immiscible alloy films

2021 ◽  
pp. 117313
Author(s):  
Yong Lu ◽  
Benjamin Derby ◽  
Sriram Hariharan ◽  
Kamal Kadirvel ◽  
Cuiping Wang ◽  
...  
2011 ◽  
Vol 357 (1) ◽  
pp. 73-77 ◽  
Author(s):  
K. Ziewiec ◽  
P. Malczewski ◽  
R. Gajerski ◽  
A. Ziewiec

2010 ◽  
Vol 654-656 ◽  
pp. 1536-1539
Author(s):  
Jiu Zhou Zhao ◽  
Hai Li Li ◽  
Qing Liang Wang

A model is developed to analyze the microstructure evolution in a continuously solidified immiscible alloy. The model takes into account the common actions of the nucleation and the diffusional growth/shrinkage of the minority phase droplets, the spatial phase segregation and the convections of the melt. The microstructure formation in a continuously solidified immiscible alloy is calculated. The numerical results demonstrate that the convective flow has great effect on the microstructure evolution. The convective flow against the solidification direction causes an increase in the nucleation rate while the convective flow along the solidification direction causes a decrease in the nucleation rate of the minority phase droplets. The convective flow leads to a more nonuniform distribution of the minority phase droplets in the melt. It causes an increase in the size of the largest minority phase droplet and is against the obtaining of the immiscible alloys with a well dispersed microstructure.


2002 ◽  
Vol 715 ◽  
Author(s):  
Zhi-Feng Huang ◽  
Rashmi C. Desai

AbstractThe morphological and compositional instabilities in the heteroepitaxial strained alloy films have attracted intense interest from both experimentalists and theorists. To understand the mechanisms and properties for the generation of instabilities, we have developed a nonequilibrium, continuum model for the dislocation-free and coherent film systems. The early evolution processes of surface pro.les for both growing and postdeposition (non-growing) thin alloy films are studied through a linear stability analysis. We consider the coupling between top surface of the film and the underlying bulk, as well as the combination and interplay of different elastic effects. These e.ects are caused by filmsubstrate lattice misfit, composition dependence of film lattice constant (compositional stress), and composition dependence of both Young's and shear elastic moduli. The interplay of these factors as well as the growth temperature and deposition rate leads to rich and complicated stability results. For both the growing.lm and non-growing alloy free surface, we determine the stability conditions and diagrams for the system. These show the joint stability or instability for film morphology and compositional pro.les, as well as the asymmetry between tensile and compressive layers. The kinetic critical thickness for the onset of instability during.lm growth is also calculated, and its scaling behavior with respect to misfit strain and deposition rate determined. Our results have implications for real alloy growth systems such as SiGe and InGaAs, which agree with qualitative trends seen in recent experimental observations.


2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.


2005 ◽  
Vol 96 (2) ◽  
pp. 141-147 ◽  
Author(s):  
Sung-Min Lee ◽  
Suk-Joong L. Kang

2019 ◽  
Author(s):  
Taeseon Lee ◽  
Ali Nassiri ◽  
Taylor Dittrich ◽  
Anupam Vivek ◽  
Glenn Daehn

2020 ◽  
Vol 53 (16) ◽  
pp. 7198-7206 ◽  
Author(s):  
Seonghan Lee ◽  
Jaeman J. Shin ◽  
Kang Hee Ku ◽  
Young Jun Lee ◽  
Se Gyu Jang ◽  
...  

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