GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off

2017 ◽  
Vol 416 ◽  
pp. 1007-1012 ◽  
Author(s):  
Fengwen Mu ◽  
Yuki Morino ◽  
Kathleen Jerchel ◽  
Masahisa Fujino ◽  
Tadatomo Suga
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Direct Wafer Bonding ◽  
Lift Off

scholarly journals Effects of surface activation time on Si-Si direct wafer bonding at room temperature

2021 ◽  
Author(s):  
Song Yang ◽  
Yongfeng Qu ◽  
Ningkang Deng ◽  
Kang Wang ◽  
Shi He ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Surface Activation ◽  
Activation Time ◽  
Direct Wafer Bonding

Direct wafer bonding of Ga2O3–SiC at room temperature

2019 ◽  
Vol 45 (5) ◽  
pp. 6552-6555 ◽  
Author(s):  
Yang Xu ◽  
Fengwen Mu ◽  
Yinghui Wang ◽  
Dapeng Chen ◽  
Xin Ou ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Direct Wafer Bonding

Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques

2017 ◽  
Vol 64 (9) ◽  
pp. 3601-3608 ◽  
Author(s):  
Seong Kwang Kim ◽  
Jae-Phil Shim ◽  
Dae-Myeong Geum ◽  
Chang Zoo Kim ◽  
Han-Sung Kim ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Lift Off

Direct Wafer Bonding of SiC-SiC at Room Temperature by SAB Method

2016 ◽  
Vol 75 (9) ◽  
pp. 77-83 ◽  
Author(s):  
F. Mu ◽  
K. Iguchi ◽  
H. Nakazawa ◽  
Y. Takahashi ◽  
M. Fujino ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Direct Wafer Bonding

Chemical lift-off and direct wafer bonding of GaN/InGaN P–I–N structures grown on ZnO

2016 ◽  
Vol 435 ◽  
pp. 105-109 ◽  
Author(s):  
K. Pantzas ◽  
D.J. Rogers ◽  
P. Bove ◽  
V.E. Sandana ◽  
F.H. Teherani ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Lift Off

Mechanisms for room temperature direct wafer bonding

2013 ◽  
Vol 113 (9) ◽  
pp. 094905 ◽  
Author(s):  
T. Plach ◽  
K. Hingerl ◽  
S. Tollabimazraehno ◽  
G. Hesser ◽  
V. Dragoi ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Direct Wafer Bonding

Room temperature SiC-SiC direct wafer bonding by SAB methods

2017 ◽  
Author(s):  
Fengwen Mu ◽  
Kenichi Iguchi ◽  
Haruo Nakazawa ◽  
Yoshikazu Takahashi ◽  
Masahisa Fujino ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Room Temperature ◽  
Direct Wafer Bonding

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology
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