Ultrafine particle removal and generation by portable air cleaners

2008 ◽  
Vol 42 (20) ◽  
pp. 5003-5014 ◽  
Author(s):  
Michael S. Waring ◽  
Jeffrey A. Siegel ◽  
Richard L. Corsi
Keyword(s):  
Ultrafine Particle ◽  
Particle Removal ◽  
Air Cleaners

Ultrafine Particle Removal Using Gas Cluster Ion Beam Technology

2013 ◽  
Vol 26 (3) ◽  
pp. 328-334 ◽  
Author(s):  
Kazuya Dobashi ◽  
Kensuke Inai ◽  
Misako Saito ◽  
Toshio Seki ◽  
Takaaki Aoki ◽  
...  
Keyword(s):  
Ion Beam ◽  
Ultrafine Particle ◽  
Particle Removal ◽  
Cluster Ion ◽  
Gas Cluster Ion Beam

scholarly journals Comparative analysis of ventilation efficiency on ultrafine particle removal in university MakerSpaces

2020 ◽  
Vol 224 ◽  
pp. 117321 ◽  
Author(s):  
Lynn E. Secondo ◽  
Hayat I. Adawi ◽  
John Cuddehe ◽  
Kenneth Hopson ◽  
Allison Schumacher ◽  
...  
Keyword(s):  
Comparative Analysis ◽  
Ultrafine Particle ◽  
Particle Removal ◽  
Ventilation Efficiency

Studies on Ultrafine Particle-Removal Inside a Wet Cyclone

2018 ◽  
Vol 42 (5) ◽  
pp. 349-355
Author(s):  
Jong Won Choi ◽  
Jeong Guen Kim ◽  
Young Chan Choi
Keyword(s):  
Ultrafine Particle ◽  
Particle Removal

Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O3 and HF

2021 ◽  
Vol 314 ◽  
pp. 214-217
Author(s):  
Hyeon Joon Han ◽  
Hunhee Lee ◽  
Charles Kim ◽  
Yongmok Kim ◽  
Jinok Moon ◽  
...  
Keyword(s):  
Hydrofluoric Acid ◽  
Semiconductor Manufacturing ◽  
Ultrafine Particle ◽  
High Reactivity ◽  
High Impact ◽  
Manufacturing Processes ◽  
Particle Removal ◽  
Cleaning Process ◽  
High Concentration ◽  
Wafer Cleaning

Sulfuric Peroxide Mixture (SPM, H2SO4 + H2O2) has been widely used in semiconductor manufacturing processes due to its high reactivity and attractive price. However, SPM releases SO42- ions that can be high impact on the environmental contaminations. Therefore, the SPM process requires a high cost wastewater treatment. So, the development of alternative chemicals has been becoming an important task in the semiconductor manufacturing process. In this paper, we evaluated the feasibility of replacing SPM with dissolved ozone water (DIO3) in the wafer cleaning process, and confirmed that the Particle removal efficiency (PRE) was improved around 68% by mixing with diluted hydrofluoric acid (DHF). And, the PRE was also increased when the concentration of ozone in dissolved ozone water increased. Additionally the PRE was improved up to 98% by combining physical cleaning after O3 process.

scholarly journals Electrostatic precipitator for fine and ultrafine particle removal from indoor air environments

2020 ◽  
Vol 247 ◽  
pp. 116964 ◽  
Author(s):  
Longwen Chen ◽  
Evelyne Gonze ◽  
Michel Ondarts ◽  
Jonathan Outin ◽  
Yves Gonthier
Keyword(s):  
Indoor Air ◽  
Electrostatic Precipitator ◽  
Ultrafine Particle ◽  
Particle Removal
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