Facile fabrication of lightweight mullite fiber/phenolic ablator with low thermal conductivity via ambient pressure impregnation

Author(s):  
Xianfeng Jia ◽  
Wenda Song ◽  
Wei Chen ◽  
Cheng Ma ◽  
Jitong Wang ◽  
...  
Molecules ◽  
2018 ◽  
Vol 23 (12) ◽  
pp. 3192 ◽  
Author(s):  
Dong Chen ◽  
Xiaodong Wang ◽  
Wenhui Ding ◽  
Wenbing Zou ◽  
Qiong Zhu ◽  
...  

Owing to their ultra-low thermal conductivity, silica aerogels are promising thermal insulators; however, their extensive application is limited by their high production cost. Thus, scientists have started to explore low-cost and easy preparation processes of silica aerogels. In this work, a low-cost method was proposed to prepare silica aerogels with industrial silica hydrosol and a subsequent ambient pressure drying (APD) process. Various surfactants (cationic, amphoteric, or anionic) were added to avoid solvent exchange and surface modification during the APD process. The effects of various surfactants on the microstructure, thermal conductivity, and thermal stability of the silica aerogels were studied. The results showed that the silica aerogels prepared with a cationic or anionic surfactant have better thermal stability than that prepared with an amphoteric surfactant. After being heated at 600 °C, the silica aerogel prepared with a cationic surfactant showed the highest specific surface area of 131 m2∙g−1 and the lowest thermal conductivity of 0.038 W∙m−1∙K−1. The obtained low-cost silica aerogel with low thermal conductivity could be widely applied as a thermal insulator for building and industrial energy-saving applications.


Carbon ◽  
2016 ◽  
Vol 108 ◽  
pp. 551-560 ◽  
Author(s):  
Xianfeng Jia ◽  
Bowen Dai ◽  
Zhaoxian Zhu ◽  
Jitong Wang ◽  
Wenming Qiao ◽  
...  

RSC Advances ◽  
2015 ◽  
Vol 5 (7) ◽  
pp. 5197-5204 ◽  
Author(s):  
Kang Guo ◽  
Zijun Hu ◽  
Huaihe Song ◽  
Xian Du ◽  
Liang Zhong ◽  
...  

SEM and TEM pictures show that GNSs can be well-dispersed in a carbon matrix. The resultant composite CAs exhibited high compression strength and extremely low thermal conductivity of 0.028 W m−1 K−1.


2021 ◽  
Vol 8 ◽  
Author(s):  
Riyong Liu ◽  
Jin Wang ◽  
Jianhe Liao ◽  
Xuetong Zhang

A robust silica–polyimide (PI) aerogel blanket is designed and synthesized using the PI foam as the matrix and silica aerogel as the filler through an in situ method, where sol–gel transition of silica precursor occurs in pores of the PI foam, followed by the hydrophobization and ambient pressure drying. The density of the aerogel blanket ranges from 0.036 to 0.196 g/cm3, and the low density is directly controlled by tailoring the silica concentration. The specific surface area of the aerogel blanket reaches 728 m2/g. These features of the blanket result in a low thermal conductivity of 0.018 W/mK, which shows a remarkable reduction of 59% compared to that of the PI foam (0.044 W/mK). As a result, a remarkable decrease of 138°C is achieved using the silica blanket as the thermal insulator on a hot plate of approximately 250°C. In addition, the temperature degradation of the blanket is around 500°C, and up to 86% of mass remaining at 900°C is obtained. The blanket is resistant at extremely harsh conditions, e.g., 600°C for 30 min and 1,300°C for 1 min, and no open flame is observed, suggesting a significant flame-retardant of the blanket. Owing to the three-dimensional (3D) porous framework of the PI foam, the silica aerogel is encapsulated in the PI foam and the blanket exhibits strong mechanical property. The silica–PI aerogel can be reversibly compressed for 50 cycles without reduction of strain. The contact angle of the blanket is 153°, which shows a superior waterproof property. Combining with the low density, low thermal conductivity, flame-retardant, and strong mechanical strength, the aerogel blanket has the potential as an artificial island, which is safe (waterproof and flame-retardant), lightweight, comfortable, and easy to be moved.


2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.


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