scholarly journals A fully-coupled computational framework for large-scale simulation of fluid-driven fracture propagation on parallel computers

2020 ◽  
Vol 372 ◽  
pp. 113365 ◽  
Author(s):  
Bianca Giovanardi ◽  
Santiago Serebrinsky ◽  
Raúl Radovitzky
1998 ◽  
Vol 152 (1-2) ◽  
pp. 85-102 ◽  
Author(s):  
Hesheng Bao ◽  
Jacobo Bielak ◽  
Omar Ghattas ◽  
Loukas F. Kallivokas ◽  
David R. O'Hallaron ◽  
...  

Author(s):  
D.Zh. Akhmed-Zaki ◽  
T.S. Imankulov ◽  
B. Matkerim ◽  
B.S. Daribayev ◽  
K.A. Aidarov ◽  
...  

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Mohammadreza Yaghoobi ◽  
Krzysztof S. Stopka ◽  
Aaditya Lakshmanan ◽  
Veera Sundararaghavan ◽  
John E. Allison ◽  
...  

AbstractThe PRISMS-Fatigue open-source framework for simulation-based analysis of microstructural influences on fatigue resistance for polycrystalline metals and alloys is presented here. The framework uses the crystal plasticity finite element method as its microstructure analysis tool and provides a highly efficient, scalable, flexible, and easy-to-use ICME community platform. The PRISMS-Fatigue framework is linked to different open-source software to instantiate microstructures, compute the material response, and assess fatigue indicator parameters. The performance of PRISMS-Fatigue is benchmarked against a similar framework implemented using ABAQUS. Results indicate that the multilevel parallelism scheme of PRISMS-Fatigue is more efficient and scalable than ABAQUS for large-scale fatigue simulations. The performance and flexibility of this framework is demonstrated with various examples that assess the driving force for fatigue crack formation of microstructures with different crystallographic textures, grain morphologies, and grain numbers, and under different multiaxial strain states, strain magnitudes, and boundary conditions.


2021 ◽  
Author(s):  
Maxwell Adam Levinson ◽  
Justin Niestroy ◽  
Sadnan Al Manir ◽  
Karen Fairchild ◽  
Douglas E. Lake ◽  
...  

AbstractResults of computational analyses require transparent disclosure of their supporting resources, while the analyses themselves often can be very large scale and involve multiple processing steps separated in time. Evidence for the correctness of any analysis should include not only a textual description, but also a formal record of the computations which produced the result, including accessible data and software with runtime parameters, environment, and personnel involved. This article describes FAIRSCAPE, a reusable computational framework, enabling simplified access to modern scalable cloud-based components. FAIRSCAPE fully implements the FAIR data principles and extends them to provide fully FAIR Evidence, including machine-interpretable provenance of datasets, software and computations, as metadata for all computed results. The FAIRSCAPE microservices framework creates a complete Evidence Graph for every computational result, including persistent identifiers with metadata, resolvable to the software, computations, and datasets used in the computation; and stores a URI to the root of the graph in the result’s metadata. An ontology for Evidence Graphs, EVI (https://w3id.org/EVI), supports inferential reasoning over the evidence. FAIRSCAPE can run nested or disjoint workflows and preserves provenance across them. It can run Apache Spark jobs, scripts, workflows, or user-supplied containers. All objects are assigned persistent IDs, including software. All results are annotated with FAIR metadata using the evidence graph model for access, validation, reproducibility, and re-use of archived data and software.


VLSI Design ◽  
1998 ◽  
Vol 8 (1-4) ◽  
pp. 53-58
Author(s):  
Christopher M. Snowden

A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling active devices. The model is applied to the non-isothermal simulation of pseudomorphic high electron mobility transistors (pHEMTs). A large-scale surface temperature model is described which allows thermal modelling of semiconductor devices and monolithic circuits. An example of the application of thermal modelling to monolithic circuit characterization is given.


1977 ◽  
Vol 3 (1/2) ◽  
pp. 126
Author(s):  
W. Brian Arthur ◽  
Geoffrey McNicoll

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