Effect of interface debonding on the thermal conductivity of microencapsulated-paraffin filled epoxy matrix composites

2012 ◽  
Vol 43 (3) ◽  
pp. 325-332 ◽  
Author(s):  
Jun-Feng Su ◽  
Yun-Hui Zhao ◽  
Xin-Yu Wang ◽  
Hua Dong ◽  
Sheng-Bao Wang
2014 ◽  
Vol 26 (1) ◽  
pp. 26-31 ◽  
Author(s):  
Karolina Gaska ◽  
Andrzej Rybak ◽  
Czeslaw Kapusta ◽  
Robert Sekula ◽  
Artur Siwek

2017 ◽  
Vol 727 ◽  
pp. 546-552
Author(s):  
Xia Jun Wang ◽  
Dong Lin Zhao ◽  
Dong Dong Zhang ◽  
Cheng Li ◽  
Ran Ran Yao

Graphene nanosheets (GNSs) were modified with aqueous ammonia and hydrogen peroxide, to obtain amine (–NH2) functionalized GNSs (AFGNSs) and enhance the bondings between the GNSs and epoxy matrix. We report an easy and efficient approach to improve the mechanical properties and thermal conductivity of epoxy matrix composites by combining one dimensional multi-walled carbon nanotubes and two dimensional AFGNSs. The long and tortuous MWCNTs can bridge adjacent AFGNSs and inhibit their aggregation, resulting in an increased contact surface area between GNS/MWCNT structures and the polymer. A remarkable synergetic effect between the GNSs and MWCNTs on the enhanced mechanical properties and thermal conductivity of the epoxy composites was demonstrated. The addition of 2 wt.% MWCNT-GNS hybrid fillers improved the tensile strength and flexural strength of the pristine epoxy by 20.71% and 55.51%, respectively. Thermal conductivity increased by 93.71% using MWCNT-GNS hybrid fillers compared to non-derivatised epoxy. This study has demonstrated that 2-D GNSs and 1-D MWCNTs have an obvious synergetic reinforcing effect on the mechanical properties and a remarkable thermal conductivity enhancement in epoxy composites which provides an easy and effective way to design and improve the properties of composite materials.


2007 ◽  
Vol 336-338 ◽  
pp. 1350-1352 ◽  
Author(s):  
Jin Tang ◽  
Ke Xin Chen ◽  
C.S. Fu

Thermally conducting, but electrically insulating, polymer-matrix composites exhibiting low dielectric constant are needed for electronic packaging. For developing such composites, this work used silicon nitride particles as fillers and epoxy as matrix. The thermal conductivity of Si3N4 particles epoxy-matrix composites was increased by up to 31.4 times than that of neat polymer by silane surface treatment of the particles prior to composites fabrication. The increase in thermal conductivity is due to decrease in the filler-matrix thermal contact resistance through the improvement of the interface between matrix and particles. At 45.4 vol. % silane-treated Si3N4 particles only, the thermal conductivity of epoxy-matrix composites reached 9.72W/ (m*K). The dielectric constant was also low (up to 5.0 at 1 MHz). However, Si3N4 addition caused the flexural strength and ductility to decrease from the values of the neat polymer.


2011 ◽  
Vol 289 (14) ◽  
pp. 1535-1542 ◽  
Author(s):  
Jun-Feng Su ◽  
Xin-Yu Wang ◽  
Zhen Huang ◽  
Yun-Hui Zhao ◽  
Xiao-Yan Yuan

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