Influence of model environment complexity on corrosion mechanism of biodegradable zinc alloys

Abstract TITANALOY is a zinc-base alloy containing copper and titanium. It can be readily formed, joined, and finished and is stronger and more dent resistant than the more common zinc alloys. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Zn-13. Producer or source: Matthiessen & Hegeler Zinc Company.

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An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0310 ◽

2012 ◽

Author(s):

Dongmei Meng ◽

Laura Buck ◽

James Cargo

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Corrosion Mechanism ◽

Fundamental Study ◽

Corrosion Failure ◽

Transmission Electron ◽

Intermetallic Compound Formation ◽

Scanning Transmission ◽

Low K

Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.

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Unique Autoclave Stress Induced Failure Mechanism

ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2005p0427 ◽

2005 ◽

Author(s):

John Butchko ◽

Bruce T. Gillette

Keyword(s):

Corrosion Rate ◽

Grain Boundary ◽

Failure Analysis ◽

Failure Mechanism ◽

Metal Corrosion ◽

Corrosion Mechanism ◽

Reliability Testing ◽

Process Change ◽

Transistor Reliability ◽

Pass Through

Abstract Autoclave Stress failures were encountered at the 96 hour read during transistor reliability testing. A unique metal corrosion mechanism was found during the failure analysis, which was creating a contamination path to the drain source junction, resulting in high Idss and Igss leakage. The Al(Si) top metal was oxidizing along the grain boundaries at a faster rate than at the surface. There was subsurface blistering of the Al(Si), along with the grain boundary corrosion. This blistering was creating a contamination path from the package to the Si surface. Several variations in the metal stack were evaluated to better understand the cause of the failures and to provide a process solution. The prevention of intergranular metal corrosion and subsurface blistering during autoclave testing required a materials change from Al(Si) to Al(Si)(Cu). This change resulted in a reduced corrosion rate and consequently prevented Si contamination due to blistering. The process change resulted in a successful pass through the autoclave testing.

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