Passive House Renovation of a Block of Flats – Measured Performance and Energy Signature Analysis

2021 ◽  
pp. 111679
Author(s):  
Jørgen Rose ◽  
Jesper Kragh ◽  
Kasper Furu Nielsen
Author(s):  
Andrea Acquaviva ◽  
Daniele Apiletti ◽  
Antonio Attanasio ◽  
Elena Baralis ◽  
Lorenzo Bottaccioli ◽  
...  

2013 ◽  
Vol 4 (2) ◽  
pp. 151-156 ◽  
Author(s):  
G. Kozma ◽  
E. Molnár ◽  
K. Czimre ◽  
J. Pénzes

Abstract In our days, energy issues belong to the most important problems facing the Earth and the solution may be expected partly from decreasing the amount of the energy used and partly from the increased utilisation of renewable energy resources. A substantial part of energy consumption is related to buildings and includes, inter alia, the use for cooling/heating, lighting and cooking purposes. In the view of the above, special attention has been paid to minimising the energy consumption of buildings since the late 1980s. Within the framework of that, the passive house was created, a building in which the thermal comfort can be achieved solely by postheating or postcooling of the fresh air mass without a need for recirculated air. The aim of the paper is to study the changes in the construction of passive houses over time. In addition, the differences between the geographical locations and the observable peculiarities with regard to the individual building types are also presented.


Author(s):  
C.K. Lakshminarayan ◽  
S. Pabbisetty ◽  
O. Adams ◽  
F. Pires ◽  
M. Thomas ◽  
...  

Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.


Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.


2018 ◽  
Author(s):  
Judith E. Grolleman ◽  
Richarda M. de Voer ◽  
Fadwa A. Elsayed ◽  
Maartje Nielsen ◽  
Robbert D. A. Weren ◽  
...  

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