A Fluorinated Low Dielectric Polymer at High Frequency Derived from Allylphenol and Benzocyclobutene by a Facile Route

2021 ◽  
pp. 110943
Author(s):  
Jiaren Hou ◽  
Jing Sun ◽  
Qiang Fang
Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4017
Author(s):  
Dorota Szwagierczak ◽  
Beata Synkiewicz-Musialska ◽  
Jan Kulawik ◽  
Norbert Pałka

New ceramic materials based on two copper borates, CuB2O4 and Cu3B2O6, were prepared via solid state synthesis and sintering, and characterized as promising candidates for low dielectric permittivity substrates for very high frequency circuits. The sintering behavior, composition, microstructure, and dielectric properties of the ceramics were investigated using a heating microscope, X-ray diffractometry, scanning electron microscopy, energy dispersive spectroscopy, and terahertz time domain spectroscopy. The studies revealed a low dielectric permittivity of 5.1–6.7 and low dielectric loss in the frequency range 0.14–0.7 THz. The copper borate-based materials, owing to a low sintering temperature of 900–960 °C, are suitable for LTCC (low temperature cofired ceramics) applications.


2018 ◽  
Vol 9 (21) ◽  
pp. 2913-2925 ◽  
Author(s):  
Ming Zeng ◽  
Jiangbing Chen ◽  
Qingyu Xu ◽  
Yiwan Huang ◽  
Zijian Feng ◽  
...  

The effects of the reaction solvent on the preparation, polymerization kinetics, and high-frequency dielectric properties of aliphatic main-chain benzoxazine copolymers were investigated.


2018 ◽  
Vol 2018 (1) ◽  
pp. 000476-000482 ◽  
Author(s):  
Masao Tomikawa ◽  
Hitoshi Araki ◽  
Yohei Kiuchi ◽  
Akira Shimada

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000678-000682
Author(s):  
Allan Beikmohamadi ◽  
Patricia Graddy ◽  
Deepukumar Nair ◽  
Jim Parisi ◽  
Steve Stewart

Low Temperature Co-fired Ceramic (LTCC) with low dielectric loss is suitable for use on microwave and millimeter wave circuits. Thick film gold or silver conductors are used as metallization on LTCC substrates. Gold prices are increasing at a rapid rate, so efforts were made to lower the dependency on gold by substituting silver with Ni/Au surface finishes as the top conductor. The external thick film silver conductors were plated using a standard Electroless Nickel Immersion Gold (ENIG) process. The Ni/Au surface finishes provides substantial improvement to fretting corrosion, environmental protection, contact resistance, wire bond strengths, solder ability and solder joint reliability. The reliability testing of DuPont™ GreenTape™ 9K7 LTCC with Ni/Au surface finishes is being conducted. The reliability test methods & conditions were chosen from well-established industry standard test protocols. This paper reports the reliability and high frequency testing results on the ENIG plated GreenTape™ 9K7 LTCC system.


2018 ◽  
Vol 6 (10) ◽  
pp. 13518-13523 ◽  
Author(s):  
Xingrong Chen ◽  
Linxuan Fang ◽  
Xiaoyao Chen ◽  
Junfeng Zhou ◽  
Jiajia Wang ◽  
...  

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