Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy

2004 ◽  
Vol 26 (8) ◽  
pp. 865-872 ◽  
Author(s):  
J Pang
1999 ◽  
Vol 41 (3) ◽  
pp. 289-296 ◽  
Author(s):  
X.Q Shi ◽  
H.L.J Pang ◽  
W Zhou ◽  
Z.P Wang

2004 ◽  
Vol 462-463 ◽  
pp. 408-412 ◽  
Author(s):  
John H.L. Pang ◽  
B.S. Xiong ◽  
T.H. Low

2017 ◽  
Vol 734 ◽  
pp. 194-201 ◽  
Author(s):  
Yutaka Konishi ◽  
Takamoto Itoh ◽  
Masao Sakane ◽  
Fumio Ogawa ◽  
Hideyuki Kanayama

This paper investigates the fatigue results in low cycle fatigue region obtained from a miniaturized specimen having a 6mm gage length, 3mm diameter and 55mm total length. Fatigue tests were performed for two type lead-free solders using horizontal-type electrical servo hydraulic push-pull fatigue testing machine. Materials employed were Sn-3.0Ag-0.5Cu and Sn-5Sb. The results from Sn-3.0Ag-0.5Cu were compared with those obtained using a bulk specimen in a previous study. Relationship between strain range and number of cycles to failure of the small-sized specimen agreed with those of the bulk specimens. The testing techniques are applicable to Sn-5Sb following the Manson-Coffin law. These results confirm that the testing technique proposed here, using small-sized specimen, is suitable to get fruitful fatigue data for lead-free solder compounds.


2002 ◽  
Vol 31 (5) ◽  
pp. 456-465 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh

Sign in / Sign up

Export Citation Format

Share Document