On anisotropic plasticity models using linear transformations on the deviatoric stress: Physical constraints on plastic flow in generalized plane strain

2019 ◽  
Vol 161-162 ◽  
pp. 105044 ◽  
Author(s):  
C. Butcher ◽  
A. Abedini
Keyword(s):  
Plane Strain ◽  
Plastic Flow ◽  
Deviatoric Stress ◽  
Linear Transformations ◽  
Anisotropic Plasticity ◽  
Physical Constraints ◽  
Generalized Plane Strain

scholarly journals Generalized Plane Strain Elasticity Problems

1995 ◽  
Author(s):  
A.H.-D. Cheng ◽  
J.J. Rencis ◽  
Y. Abousleiman
Keyword(s):  
Plane Strain ◽  
Elasticity Problems ◽  
Generalized Plane Strain

Effects of Crystallographic Texture on Plastic Flow Localization

2007 ◽  
Vol 340-341 ◽  
pp. 211-216
Author(s):  
Mitsutoshi Kuroda
Keyword(s):  
Shear Band ◽  
Plane Strain ◽  
Plastic Flow ◽  
Texture Component ◽  
Three Dimensional ◽  
Cube Texture ◽  
Shear Band Formation ◽  
Flow Localization ◽  
Band Formation ◽  
Plastic Flow Localization

In this study, effects of typical texture components observed in rolled aluminum alloy sheets (i.e. Copper, Brass, S, Cube and Goss texture components) on plastic flow localization are studied. The material response is described by a generalized Taylor-type polycrystal model, in which each grain is characterized in terms of an elastic-viscoplastic continuum slip constitutive relation. First, forming limits of thin sheet set by sheet necking are predicted using a Marciniak–Kuczynski (M–K-) type approach. It is shown that only the Cube texture component yields forming limits higher than that for a random texture in the biaxial stretch range. Next, three-dimensional shear band analyses are performed, using a three-dimensional version of M–K-type model, but the overall deformation mode is restricted to a plane strain state. From this simple model analysis, two important quantities regarding shear band formation are obtained: i.e. the critical strain at the onset of shear banding and the corresponding orientation of shear band. It is concluded that the Cube texture component is said to be a shear band free texture, while some texture components exhibit significantly low resistance to shear band formation. Finally, shear band developments in plane strain pure bending of sheet specimens with the typical textures are studied.

Curvature and Out-of-Plane-Strain for Generalized Plane Strain

1972 ◽  
Vol 39 (3) ◽  
pp. 827-829 ◽  
Author(s):  
V. J. Parks
Keyword(s):  
Plane Strain ◽  
Cross Section ◽  
Central Region ◽  
Transverse Cross Section ◽  
Infinite Length ◽  
Out Of Plane ◽  
Plane Solution ◽  
Generalized Plane Strain

Out-of-plane strains and stresses are determined using reciprocity for the central region of very long bars (approaching infinite length) of uniform transverse cross section subjected to the same in-plane loads on every cross section. The loading explicitly specifies no end loads on the bars. The results are obtained without recourse to the in-plane solution. Conversely the end force and moment are determined for the case where the out-of-plane strain is zero.

Thermal Stresses in Layered Electrical Assemblies Bonded With Solder

1991 ◽  
Vol 113 (4) ◽  
pp. 350-354 ◽  
Author(s):  
H. S. Morgan
Keyword(s):  
Residual Stresses ◽  
Plane Strain ◽  
3D Model ◽  
Thermal Stresses ◽  
Three Dimensional ◽  
Creep Models ◽  
Strain Model ◽  
Maximum Stresses ◽  
Generalized Plane Strain ◽  
Plane Strain Model

Thermal stresses in a layered electrical assembly joined with solder are computed with plane strain, generalized plane strain, and three-dimensional (3D) finite element models to assess the accuracy of the two-dimensional (2D) modeling assumptions. Cases in which the solder is treated as an elastic and as a creeping material are considered. Comparison of the various solutions shows that, away from the corners, the generalized plane strain model produces residual stresses that are identical to those computed with the 3D model. Although the generalized plane strain model cannot capture corner stresses, the maximum stresses computed with this 2D model are, for the mesh discretization used, within 12 percent of the corner stresses computed with the 3D model when the solder is modeled elastically and within 5 percent when the solder is modeled as a creeping material. Plane strain is not a valid assumption for predicting thermal stresses, especially when creep of the solder is modeled. The effect of cooling rate on the residual stresses computed with creep models is illustrated.

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