Correlation of heat transfer coefficient for two-component two-phase slug flow in a vertical pipe

2018 ◽  
Vol 108 ◽  
pp. 124-139 ◽  
Author(s):  
Chuanshuai Dong ◽  
Takashi Hibiki
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Slug Flow ◽  
Vertical Pipe ◽  
Two Phase ◽  
Two Component

Numerical Simulation of Thermofluid Characteristics of Two-Phase Slug Flow in Microchannels

2010 ◽  
Author(s):  
A. Mehdizadeh ◽  
S. A. Sherif ◽  
W. E. Lear
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Flow Field ◽  
Transfer Coefficient ◽  
Convective Heat Transfer ◽  
Slug Flow ◽  
Single Phase ◽  
Solid Wall ◽  
Heat Transfer Characteristics ◽  
Two Phase

A fundamental study of heat transfer characteristics of two-phase slug flow in microchannels is carried out employing the Volume-of-Fluid (VOF) method. Despite of the fact that numerical simulations of two-phase flows in microchannels have been attempted by many investigators, most efforts seem to have failed in correctly capturing the flow physics, especially those pertaining to the slug flow regime characteristics. The presence of a thin liquid film in the order of 10 μm around the bubble is a contributing factor to the above difficulty. Typically, liquid films have a significant effect on the flow field and heat transfer characteristics. In the simulations reported in this paper, the film is successfully captured and a very high local convective heat transfer coefficient is observed in the film region. A strong coupling between the conductive heat transfer in the solid wall and the convective heat transfer in the flow field is observed and characterized. Results showed that unsteady heat transfer through the solid wall in the axial direction is comparable to that in the radial direction. Results also showed that a fully developed condition could be achieved fairly quickly compared to single-phase flows. The fully developed condition is defined based on the Peclet number (Pe) and a dimensionless length of the liquid slug. Local and time-averaged Nusselt numbers for slug flows are reported for the first time. It was found that significant improvements in the heat transfer coefficient could be achieved by short slugs where the Nu number was found to be 610% higher than in single-phase flows. The study revealed new findings related to slug flow heat transfer in microchannels with constant wall heat flux.

A Loop Thermosyphon With Hydrophobic Spots Evaporator Surface

2018 ◽  
Author(s):  
Hongbin He ◽  
Biao Shen ◽  
Sumitomo Hidaka ◽  
Koji Takahashi ◽  
Yasuyuki Takata
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Nucleate Boiling ◽  
Working Fluid ◽  
Immersion Method ◽  
Two Phase ◽  
Coating Materials ◽  
High Heat Transfer ◽  
Coated Surface

Heat transfer characteristic of a closed two-phase thermosyphon with enhanced boiling surface is studied and compared with that of a copper mirror surface. Two-phase cooling improves heat transfer coefficient (HTC) a lot compared to single-phase liquid cooling. The evaporator surfaces, coated with a pattern of hydrophobic circle spots (non-electroplating Ni-PTFE, 0.5∼2 mm in diameter and 1.5–3 mm in pitch) on Cu substrates, achieve very high heat transfer coefficient and lower the incipience temperature overshoot using water as the working fluid. Sub-atmospheric boiling on the hydrophobic spot-coated surface shows a much better heat transfer performance. Tests with heat loads (30 W to 260 W) reveals the coated surfaces enhance nucleate boiling performance by increasing the bubbles nucleation sites density. Hydrophobic circle spots coated surface with diameter 1 mm, pitch 1.5 mm achieves the maximal heat transfer enhancement with the minimum boiling thermal resistance as low as 0.03 K/W. The comparison of three evaporator surfaces with same spot parameters but different coating materials is carried out experimentally. Ni-PTFE coated surface with immersion method performs the optimal performance of the thermosyphon.

On the Application of Macro-Pipe Two-Phase Heat Transfer Correlations and Flow Regime Maps to Mini-Channels

2006 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Ilai Sher ◽  
Emil Rahim
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Flow Regime ◽  
Annular Flow ◽  
Negative Slope ◽  
Two Phase ◽  
Heat Transfer Correlations ◽  
Two Phase Heat Transfer ◽  
Flow Regime Maps

The present study is aimed at evaluating the ability of conventional “macro-pipe” correlations and regime transitions to predict the two-phase thermofluid characteristics of mini-channel cold plates. Use is made of the Taitel-Dukler flow regime maps, seven classical heat transfer coefficient correlations and two dryout predictions. The vast majority of the mini-channel two-phase heat-transfer data, taken from the literature, is predicted to fall in the annular regime, in agreement with the reported observations. A characteristic heat transfer coefficient locus has been identified, with a positive slope following the transition from Intermittent to Annular flow and a negative slope following the onset of partial dryout at higher qualities. While the classical two-phase heat transfer correlations are generally capable of providing good agreement with the low-quality annular flow data the quality at which partial dryout occurs and the ensuing heat transfer rates are not predictable by the available macro-pipe correlations.

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

2001 ◽  
Author(s):  
S. I. Haider ◽  
Yogendra K. Joshi ◽  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Closed Loop ◽  
Two Phase Flow ◽  
Natural Circulation ◽  
Saturation Temperature ◽  
Electronics Cooling ◽  
Phase Flow ◽  
Two Phase

Abstract The study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. Most available models deal with two-phase thermosyphons with counter-current circulation within a closed, vertical, wickless heat pipe. The present research focuses on CLTPTs for electronics cooling that face more complex two-phase flow patterns than the vertical heat pipes, due to closed loop geometry and smaller tube size. The present model is based on mass, momentum, and energy balances in the evaporator, rising tube, condenser, and the falling tube. The homogeneous two-phase flow model is used to evaluate the friction pressure drop of the two-phase flow imposed by the available gravitational head through the loop. The saturation temperature dictates both the chip temperature and the condenser heat rejection capacity. Thermodynamic constraints are applied to model the saturation temperature, which also depends upon the local heat transfer coefficient and the two-phase flow patterns inside the condenser. The boiling characteristics of the enhanced structure are used to predict the chip temperature. The model is compared with experimental data for dielectric working fluid PF-5060 and is in general agreement with the observed trends. The degradation of condensation heat transfer coefficient due to diminished vapor convective effects, and the presence of subcooled liquid in the condenser are expected to cause higher thermal resistance at low heat fluxes. The local condensation heat transfer coefficient is a major area of uncertainty.

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