scholarly journals Stress intensity factors for an edge interface crack in a bonded semi-infinite plate for arbitrary material combination

2012 ◽  
Vol 49 (10) ◽  
pp. 1241-1251 ◽  
Author(s):  
Nao-Aki Noda ◽  
Xin Lan
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Infinite Plate ◽  
Intensity Factors ◽  
Material Combination

Single and Double Edge Interface Cracks in a Bonded Plate under Arbitrary Material Combination

2010 ◽  
Vol 452-453 ◽  
pp. 245-248
Author(s):  
Xin Lan ◽  
Naoaki Noda ◽  
Yu Zhang ◽  
Mitinaka Kengo
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
The Finite Element Method ◽  
Intensity Factors ◽  
Material Combination ◽  
Double Edge ◽  
Dimensionless Stress ◽  
Crack Problems ◽  
Previously Treated

Although a lot of interface crack problems were previously treated, few solutions are available under arbitrary material combinations. This paper deals with a single edge interface crack as well as a double edge interface crack in a bonded plate. Then, the effects of material combination on the stress intensity factors are discussed. A useful method to calculate the stress intensity factor of interface crack is presented with focusing on the stresses at the crack tip calculated by the finite element method. Then, the stress intensity factors are indicated in charts under arbitrary material combinations. Specifically, some necessary skills as refined mesh and extrapolations of the stress intensity factors are used to improve the accuracy of the calculation. It has been proved that the values shown in this paper have at least 3-digit accuracy. For the edge interface crack, it is found that the dimensionless stress intensity factors are not always finite depending on Dunders’ parameters , . For example, they are infinite when . And they are finite when , and zero when .

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

2003 ◽  
Author(s):  
Won-Keun Kim ◽  
Toru Ikeda ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Interface Crack ◽  
Stress Intensity Factors ◽  
Flip Chip ◽  
Liquid Crystal Display ◽  
Dissimilar Materials ◽  
Circuit Board ◽  
Electrical Performance ◽  
Intensity Factors ◽  
Adhesive Film

Anisotropic Conductive Adhesive Film (ACF) has been used for electronic assemblies such as the connection between a Liquid Crystal Display (LCD) panel and a flexible print circuit board (FPC). ACF is expected to be a key technology for flip chip packaging and chip size packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using the ACF. This study presents an evaluation technology for the delamination of the ACF connections. We utilized the stress intensity factors of an interface crack between jointed dissimilar materials. The evaluation technology presented herein was found to provide reliability of an electronic package using the ACF connection during the solder reflow process.

Sign in / Sign up

Export Citation Format

Share Document