In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste

2017 ◽  
Vol 696 ◽  
pp. 123-129 ◽  
Author(s):  
Hao Zhang ◽  
Yue Gao ◽  
Jinting Jiu ◽  
Katsuaki Suganuma
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering ◽  
Silver Paste

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

2007 ◽  
Vol 36 (10) ◽  
pp. 1333-1340 ◽  
Author(s):  
Tao Wang ◽  
Xu Chen ◽  
Guo-Quan Lu ◽  
Guang-Yin Lei
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering ◽  
Silver Paste ◽  
Nano Silver

Investigation of low-temperature sintering of silver paste

2015 ◽  
Vol 29 (12) ◽  
pp. 974-979
Author(s):  
V.I. Lukin ◽  
V.S. Rylnikov ◽  
A.N. Afanasyev-Khodykin ◽  
Yu.V. Loshchinin
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering ◽  
Silver Paste

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

2012 ◽  
Vol 706-709 ◽  
pp. 2962-2967 ◽  
Author(s):  
Akio Hirose ◽  
Naoya Takeda ◽  
Yosuke Konaka ◽  
Hiroaki Tatsumi ◽  
Yusuke Akada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Bonding Process ◽  
Low Temperature Sintering ◽  
High Melting Point ◽  
Organic Nanoparticles ◽  
High Temperature Electronics ◽  
Low Temperature Bonding

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

scholarly journals Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

2013 ◽  
Vol 54 (6) ◽  
pp. 872-878 ◽  
Author(s):  
Fengwen Mu ◽  
Zhenyu Zhao ◽  
Guisheng Zou ◽  
Hailin Bai ◽  
Aiping Wu ◽  
...  
Keyword(s):  
Silver Nanoparticles ◽  
Low Temperature ◽  
Silver Oxide ◽  
Low Temperature Sintering
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