Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power
2017 ◽
Vol 705
◽
pp. 188-197
◽
Effect of aging temperature on microstructure and mechanical properties of Sn–9Zn–xZrC solder joints
2018 ◽
Vol 30
(1)
◽
pp. 753-759
◽
2018 ◽
Vol 5
(1)
◽
pp. 2733-2737
◽
2017 ◽
Vol 683
◽
pp. 83-89
◽
2018 ◽
Vol 119
(8)
◽
pp. 810-815