Improving the crack resistance and fracture toughness of Cu/Ru multilayer thin films via tailoring the individual layer thickness

2018 ◽  
Vol 742 ◽  
pp. 45-53 ◽  
Author(s):  
Qing Zhou ◽  
Shuang Zhang ◽  
Xuezi Wei ◽  
Fei Wang ◽  
Ping Huang ◽  
...  
2004 ◽  
Vol 443-444 ◽  
pp. 193-196 ◽  
Author(s):  
M. Hecker ◽  
N. Mattern ◽  
W. Brückner ◽  
C.M. Schneider

The subject of the present investigation is the influence of annealing on the microstructure of Co thin films. In particular, the evolution of the texture during annealing is studied and compared with that of Co/Cu multilayers of different individual layer thicknesses. 400nm thick Co films show a h.c.p. structure with a weak preference of the <001> texture component and a broad distribution of grain orientations. Annealing at about 350°C results in a strong increase of the h.c.p. <001> component, nearly complete disappearance of the statistical distribution and grain growth of a minor f.c.c. fraction in the films. In-situ XRD measurements on single Co films during annealing confirm that the texture change is irreversible. Multilayer stacks of Co/Cu layers show various texture changes depending on the individual layer thickness (ranging between 100nm and 1nm). Generally, with decreasing individual layer thickness and increasing annealing temperature the f.c.c. content in the multilayers increases at the expense of the h.c.p. fraction.


2012 ◽  
Vol 621 ◽  
pp. 23-26
Author(s):  
Wei Rao ◽  
Ding Guo Li ◽  
Hong Chun Yan

Ba0.8Sr0.2TiO3 thin films were prepared with various individual layer thicknesses using a sol– gel process. The individual layer thickness strongly affected the structure, ferroelectricity, and dielectric properties of the films. The films prepared with an individual layer thickness of 60 nm showed small equiaxed grains, cubic structure, temperature-independent dielectric constant, and no ferroelectricity. The films prepared with an individual layer thickness of 8 nm showed columnar grains, tetragonal structure, good ferroelectricity, and two dielectric peaks in the dielectric constant–temperature curve. The individual layer thickness for layer-by-layer homoepitaxy growth that resulted in columnar grains was <20 nm.


2004 ◽  
Vol 83 (10) ◽  
pp. 2616-2618 ◽  
Author(s):  
Jian-Gong Cheng ◽  
Xiang-Jian Meng ◽  
Jun Tang ◽  
Shao-Ling Guo ◽  
Jun-Hao Chu ◽  
...  

Materialia ◽  
2019 ◽  
Vol 7 ◽  
pp. 100400 ◽  
Author(s):  
A.V. Druzhinin ◽  
D. Ariosa ◽  
S. Siol ◽  
N. Ott ◽  
B.B. Straumal ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document