scholarly journals Thermomechanical properties and microstructures of yttrium hydride

2021 ◽  
Vol 867 ◽  
pp. 158992
Author(s):  
Xunxiang Hu ◽  
Kurt A. Terrani
MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.


2020 ◽  
pp. 58-66
Author(s):  
N. T. Kakhramanov ◽  
◽  
I. V. Bayramova ◽  
S. S. Pesetsky ◽  
◽  
...  

2020 ◽  
pp. 096739112097811
Author(s):  
Munjula Siva Kumar ◽  
Santosh Kumar ◽  
Krushna Gouda ◽  
Sumit Bhowmik

The polymer composite material’s thermomechanical properties with fiber as reinforcement material have been widely studied in the last few decades. However, these fiber-based polymer composites exhibit problems such as fiber orientation, delamination, fiber defect along the length and bonding are the matter of serious concern in order to improve the thermomechanical properties and obtain isotropic material behavior. In the present investigation filler-based composite material is developed using natural hemp and high thermal conductive silver nanoparticles (SNP) and combination of dual fillers in neat epoxy polymer to investigate the synergetic influence. Among various organic natural fillers hemp filler depicts good crystallinity characteristics, so selected as a biocompatible filler along with SNP conductive filler. For enhancing their thermal conductivity and mechanical properties, hybridization of hemp filler along with silver nanoparticles are conducted. The composites samples are prepared with three different combinations such as sole SNP, sole hemp and hybrid (SNP and hemp) are prepared to understand their solo and hybrid combination. From results it is examined that, chemical treated hemp filler has to maximized its relative properties and showed, 40% weight % of silver nanoparticles composites have highest thermal conductivity 1.00 W/mK followed with hemp filler 0.55 W/mK and hybrid 0.76 W/mK composites at 7.5% of weight fraction and 47.5% of weight fraction respectively. The highest tensile strength is obtained for SNP composite 32.03 MPa and highest young’s modulus is obtained for hybrid composites. Dynamic mechanical analysis is conducted to find their respective storage modulus and glass transition temperature and that, the recorded maximum for SNP composites with 3.23 GPa and 90°C respectively. Scanning electron microscopy examinations clearly illustrated that formation of thermal conductivity chain is significant with nano and micro fillers incorporation.


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