Thermal properties and failure mechanism of graphene nanoplatelet-reinforced copper composites fabricated using electroless plating

2022 ◽  
Vol 893 ◽  
pp. 162233
Author(s):  
Jun Zhang ◽  
Jun Hyun Han
2011 ◽  
Vol 158 (12) ◽  
pp. D689 ◽  
Author(s):  
Shiho Tokonami ◽  
Shuji Shirai ◽  
Itaru Ota ◽  
Naoki Shibutani ◽  
Yojiro Yamamoto ◽  
...  

Author(s):  
Tan Teck Chun ◽  
Tung Chih Hang ◽  
Chai Tai Chong

Abstract The effect of interfacial reaction of Ti/Ni(V)/Au under-bump metallisation (UBM) systems in Pb free solder had been investigated. The objective was to examine the microstructure change and intermetallic formation of Ni-based UBM during isothermal annealing in lead free solder as well as to understand its impact on the UBM failure mechanism. Studies revealed that after IR reflow, spalling of Ni-Sn compound from the UBM took place. A layer of Ni-Sn-V was found to have form in the UBM. The formation of Ni-Sn-V layer was believed to have an impact on the failure mechanism of the Pb free solder. Studies also showed that doubling the Ni layer thickness in this UBM system did not have significant improvement to the overall integrity of the solder joint. However, samples with electroless Ni(P)/Au UBM in lead free solder showed relatively good thermal properties. No major change in the intermetallic composition was observed. More details on the microstructure change during thermal aging of the UBM systems were presented in this article.


Polymers ◽  
2021 ◽  
Vol 13 (21) ◽  
pp. 3740
Author(s):  
Mohamad Ridzuan Amri ◽  
Faizah Md Yasin ◽  
Luqman Chuah Abdullah ◽  
Syeed Saifulazry Osman Al-Edrus ◽  
Siti Fatahiyah Mohamad

This work aims to evaluate the performance of graphene nanoplatelet (GNP) as conductive filler with the presence of 0.5 wt.% cellulose nanofiber (CNF) on the physical, mechanical, conductivity and thermal properties of jatropha oil based waterborne polyurethane. Polyurethane was made from crude jatropha oil using an epoxidation and ring-opening process. 0.5, 1.0, 1.5, 2.0 wt.% GNP and 0.5 wt.% CNF were incorporated using casting method to enhance film performance. Mechanical properties were studied following standard method as stated in ASTM D638-03 Type V. Thermal stability of the nanocomposite system was studied using thermal gravimetric analysis (TGA). Filler interaction and chemical crosslinking was monitored using Fourier-transform infrared spectroscopy (FTIR) and film morphology were observed with field emission scanning electron microscopy (FESEM). Water uptake analysis, water contact angle and conductivity tests are also carried out. The results showed that when the GNP was incorporated at fixed CNF content, it was found to enhance the nanocomposite film, its mechanical, thermal and water behavior properties as supported by morphology and water uptake. Nanocomposite film with 0.5 wt.% GNP shows the highest improvement in term of tensile strength, Young’s modulus, thermal degradation and water behavior. As the GNP loading increases, water uptake of the nanocomposite film was found relatively small (<1%). Contact angle test also indicates that the film is hydrophobic with addition of GNP. The conductivity properties of the nanocomposite film were not enhanced due to electrostatic repulsion force between GNP sheet and hard segment of WBPU. Overall, with addition of GNP, mechanical and thermal properties was greatly enhanced. However, conductivity value was not enhanced as expected due to electrostatic repulsion force. Therefore, ternary nanocomposite system is a suitable candidate for coating application.


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