scholarly journals Non-destructive in-situ classification of sandstones used in the Angkor monuments of Cambodia using a portable X-ray fluorescence analyzer and magnetic susceptibility meter

2021 ◽  
Vol 39 ◽  
pp. 103137
Author(s):  
Etsuo Uchida ◽  
Ryota Watanabe ◽  
Rathborith Cheng ◽  
Yuta Nakamura ◽  
Toru Takeyama
2018 ◽  
Vol 13 (3) ◽  
pp. 270-282 ◽  
Author(s):  
Nagaraja Rao ◽  
Brian Ament ◽  
Richard Parmee ◽  
Jonathan Cameron ◽  
Martin Mayo

Britannia ◽  
2020 ◽  
Vol 51 ◽  
pp. 175-201
Author(s):  
Louisa Campbell

ABSTRACTNon-destructive analytical techniques are now widely and successfully employed in the fields of materials science and conservation. Portable X-ray fluorescence (pXRF) and portable Raman spectrometry have proven particularly valuable for the rapid in-situ analysis of samples, but their applicability for the analysis of archaeological artefacts for which survival of surface treatments can be negatively impacted by post-depositional processes has been underexplored. Roman relief-sculpted monumental inscriptions from the Antonine Wall, commonly referred to as ‘Distance Slabs’, have offered an excellent opportunity to deploy these non-destructive techniques to determine whether they were originally adorned with pigments and, if so, to identify the colours used. This is a revolutionary approach to identifying colours on ancient sandstone sculpture that transforms our understanding of these unique monuments. Elemental composition analysis by pXRF has confirmed evidence for pigments and this is supported by the Raman results, making it possible to develop and reconstruct a palette of colours that originally brought these monuments to life in vibrant polychrome. The research offers a new methodology for identifying pigments on sandstone sculpture and opens new avenues for investigating other classes of material culture alongside the development of bespoke analytical equipment.


1993 ◽  
Vol 308 ◽  
Author(s):  
Richard P. Vinci ◽  
Thomas N. Marieb ◽  
John C. Bravman

ABSTRACTStress induced voiding in passivated Cu lines was investigated by x-ray strain analysis and in-situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al underlayer were patterned by a trilayer liftoff technique and passivated with Si3N4. For direct observation of stress voiding, specimens were heated to 350ºC in the HVSEM and then cooled and held at 150ºC. Identical samples were subjected to the same thermal cycle for strain state determination using x-ray techniques. The hydrostatic stress state at each temperature was calculated from the measured strains. Few initial voids were observed after passivation in either sample. After heating to 350ºC and cooling to the dwell temperature, no new voiding was seen in the Ta/Cu lines. Measured hydrostatic strains were half those measured in the Al/Cu lines. Heavy voiding was observed in the Al/Cu lines after cooling to the dwell temperature.


2020 ◽  
Vol 62 (3) ◽  
pp. 160-162
Author(s):  
J Twydle

Previously, scientific examination of works of art was almost exclusively carried out in a specialist laboratory, major gallery or institution. Moving the artwork nearly always involved associated risks and transportation and insurance costs. Founded in 2009, The True Image Solution (TIS) had a vision to bring non-destructive technology to the artwork and to extend the possible range of evaluation by applying other imaging techniques, including ultrasound, flash thermography, X-ray spectroscopy and microwave imaging. In conjunction with English Heritage, these techniques were applied to a wide variety of objects. The results demonstrated that all of these techniques could be successfully carried out in situ and the risk of transportation damage, as well as associated transport and insurance costs, could be eliminated.


Author(s):  
Daechul Choi ◽  
Sooyoung Ji ◽  
Jaelim Choi ◽  
Miyang Kim ◽  
Eunju Yang ◽  
...  

Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.


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