Coexistence properties of phase separation and CuPt-ordering in InGaAsP grown on GaAs substrates by organometallic vapor phase epitaxy

2010 ◽  
Vol 312 (14) ◽  
pp. 2056-2059 ◽  
Author(s):  
Yohei Konaka ◽  
Ken-ichi Ono ◽  
Yoshikazu Terai ◽  
Yasufumi Fujiwara
1993 ◽  
Vol 318 ◽  
Author(s):  
Ishwara Bhat

ABSTRACTEpitaxial (100) CdTe layers have been grown by organometallic vapor phase epitaxy (OMVPE) on GaAs and Si substrates. A thin layer of CdTe was first grown by atomic layer epitaxy (ALE) on GaAs substrates followed by thicker CdTe layer by conventional organometallic vapor phase epitaxy (OMVPE). This process resulted in high quality (100) CdTe on GaAs substrates. On Si substrates, direct growth of CdTe resulted in only polycrystalline layers. Hence, a thin Ge buffer layer grown at low temperature followed by an interfacial layer of ZnTe was used to get high quality (100) CdTe on Si. The process developed here eliminates the high temperature (>850°C) deoxidation step generally required when Si substrates are used. The CdTe layers were characterized by X-ray diffraction and optical microscopy. X-ray rocking curve with full width at half maximum (FWHM) of about 260 arcsec has been obtained for a 4 um thick CdTe layer. The results presented demonstrate novel techniques to control the hetero-interfaces in order to grow high quality CdTe on GaAs and Si substrates.


2005 ◽  
Vol 44 (9A) ◽  
pp. 6403-6411 ◽  
Author(s):  
Yasushi Takano ◽  
Kazu Kobayashi ◽  
Hideaki Iwahori ◽  
Masayoshi Umezawa ◽  
Sho Shirakata ◽  
...  

1997 ◽  
Vol 484 ◽  
Author(s):  
M. T. Bulsara ◽  
C. Leitz ◽  
E. A. Fitzgerald

AbstractInxGa1−xAs structures with compositionally graded buffers were grown with organometallic vapor phase epitaxy (OMVPE) on GaAs substrates and characterized with plan-view and cross-sectional transmission electron microscopy (PV-TEM and X-TEM), atomic force microscopy (AFM), and x-ray diffraction (XRD). The results show that surface roughness experiences a maximum at growth temperatures where phase separation occurs in In.Gal.,As. The strain fields from misfit dislocations induce this phase separation in the <110> directions. At growth temperatures above and below this temperature, the surface roughness decreases significantly; however, only growth temperatures above this regime ensure nearly complete relaxed graded buffers with the most uniform composition caps. With the optimum growth temperature for grading InxGa1−x,As determined to be 700 °C, it was possible to produce In0.33Ga0.67As diodes on GaAs with threading dislocation densities < 8.5 × 106/cm2.


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