Numerical analysis of effect of thermal stress depending on pulling rate on behavior of intrinsic point defects in large-diameter Si crystal grown by Czochralski method

2020 ◽  
Vol 531 ◽  
pp. 125334 ◽  
Author(s):  
Yuji Mukaiyama ◽  
Koji Sueoka ◽  
Susumu Maeda ◽  
Masaya Iizuka ◽  
Vasif M. Mamedov
2003 ◽  
Vol 83 (15) ◽  
pp. 3048-3050 ◽  
Author(s):  
Zhenqiang Xi ◽  
Deren Yang ◽  
Jin Xu ◽  
Yujie Ji ◽  
Duanlin Que ◽  
...  

2012 ◽  
Vol 217-219 ◽  
pp. 1425-1428 ◽  
Author(s):  
Xiao Xia Liu ◽  
Li Jun He ◽  
Rui Zhou ◽  
Shao Lin Ma ◽  
Jing Mao

A numerical analysis was performed to investigate the temperature distribution and thermal stress field in monocrystal silicon rod in the cooling process of manufactured with Czochralski (CZ) method. The thermally-induced residual stress fields of silicon rod under different length of cool-down time conditions were obtained as well as temperature fields, respectively. All simulations were finished by using ANSYS finite element code. It showed that, maximum thermal stress was mainly appeared on rod surface, the influence of length of cool-down time on it was not remarkable, the magnitude of it was far below the critical strength of silicon throughout.


Author(s):  
Haixi Pan ◽  
Liping Feng ◽  
Xiaodong Zhang ◽  
Yang Chen ◽  
Gangquan Li ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document