Numerical analysis of effect of thermal stress depending on pulling rate on behavior of intrinsic point defects in large-diameter Si crystal grown by Czochralski method
2020 ◽
Vol 531
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pp. 125334
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2016 ◽
Vol 2016.29
(0)
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pp. 047
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2016 ◽
Vol 2016.29
(0)
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pp. 060
2013 ◽
Vol 363
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pp. 97-104
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2012 ◽
Vol 217-219
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pp. 1425-1428
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