Inhibition of galvanic corrosion in Al/Cu coupling model by synergistic combination of 3-Amino-1,2,4-triazole-5-thiol and cerium chloride

2020 ◽  
Vol 44 ◽  
pp. 102-115 ◽  
Author(s):  
Inime Ime Udoh ◽  
Hongwei Shi ◽  
Mohammad Soleymanibrojeni ◽  
Fuchun Liu ◽  
En-Hou Han
Keyword(s):  
Galvanic Corrosion ◽  
Coupling Model ◽  
Cerium Chloride ◽  
Synergistic Combination

A SVET study of the inhibitive effects of benzotriazole and cerium chloride solely and combined on an aluminium/copper galvanic coupling model

2016 ◽  
Vol 110 ◽  
pp. 143-156 ◽  
Author(s):  
L.B. Coelho ◽  
M. Mouanga ◽  
M.-E. Druart ◽  
I. Recloux ◽  
D. Cossement ◽  
...  
Keyword(s):  
Coupling Model ◽  
Cerium Chloride ◽  
Galvanic Coupling ◽  
Aluminium Copper

Electron-Microscopic localization of biotinylated gastrin bound to eosinophils in the rat stomach

1994 ◽  
Vol 52 ◽  
pp. 300-301
Author(s):  
Caroline A. Miller ◽  
David H. Nichols ◽  
Richard F. Murphy
Keyword(s):  
Electron Microscope ◽  
Phosphate Buffer ◽  
Uranyl Acetate ◽  
List Type ◽  
Cerium Chloride ◽  
Rat Stomach ◽  
Electron Microscopic ◽  
Human Sequence ◽  
Acetate Lead ◽  
Microscope Slides

Gastrin is a small peptide capable of both stimulating gastric acid secretion and acting as an enteric growth factor. Known functions of eosinophils in the rat stomach are related to immunological defense. Here we demonstrate the binding of biotinylated gastrin to rat stomach eosinophils in the electron microscope. Small pieces of stomach were fixed by immersion in 4% paraformaldehyde/0.1% glutaraldehyde in 0.1 M phosphate buffer, pH 7.4 for 1 hour. The tissue was then cryoprotected in 30% sucrose/0.1 M phosphate buffer, transferred to Tissue Tek OCT compound and frozen in isopentane cooled with liquid nitrogen. Transverse cryostat sections were cut at 25 μm, thawed in PBS and free floating sections exposed to 10−5 M biotinylated 1-17 gastrin (human sequence; Peninsula Labs) for 1 hour. Controls omitted the biotinylated gastrin from this step. Sections were then rinsed 3X in PBS and exposed to either:1).a 1:50 dilution of 10 nm Extravidin colloidal gold (Sigma) for 2 hours, or2).an avidin-biotin-alkaline phosphatase complex (ABC-AP;Vector) for 1 hour. A substrate solution containing cerium chloride was used to generate an electron dense reaction product.Sections from both procedures were postfixed in 1% OsO4 in 0.1 M phosphate buffer, rinsed and dehydrated. These were then flat embedded in EMbed 812 between two microscope slides coated with Liquid Release (both from Electron Microscopy Sciences).Polymerized sections were adhered to resin blocks using super glue, cut at 70-90 nm, stained with uranyl acetate/lead citrate and observed in a Philips CM-10 electron microscope.

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

Development of corrosion flaws for the production of realistic test specimens

2020 ◽  
Vol 64 (1) ◽  
pp. 23-28
Author(s):  
J. Hodač ◽  
Z. Fulín ◽  
P. Mareš ◽  
J. Veselá ◽  
O. Chocholatý
Keyword(s):  
Power Plants ◽  
Galvanic Corrosion ◽  
Water Solution ◽  
Erosive Wear ◽  
Corrosion Damage ◽  
Water Mist ◽  
Carbon Steels ◽  
Bending Stress ◽  
Solution Flow ◽  
Mechanical Bending

AbstractTo produce realistic test specimens with realistic flaws, it is necessary to develop appropriate procedure for corrosion flaw production. Tested specimens are made from steels commonly used in power plants, such as carbon steels, stainless steels and their dissimilar weldments. In this study, corrosion damage from NaCl water solution and NaCl water mist are compared. Specimens were tested with and without mechanical bending stress. The corrosion processes produced plane, pitting and galvanic corrosion. On dissimilar weldments galvanic corrosion was observed and resulted to the deepest corrosion damage. Deepest corrosion flaws were formed on welded samples. The corrosion rate was also affected by the solution flow in a contact with the specimens, which results in a corrosion-erosive wear. Produced flaws are suitable as natural crack initiators or as realistic corrosion flaws in test specimens.

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

PCB Related Field Failures with ImAg Surface Finishes

2007 ◽  
Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis
Keyword(s):  
Emerging Markets ◽  
Galvanic Corrosion ◽  
Electrochemical Migration ◽  
Copper Sulphide ◽  
Electronic Components ◽  
Related Field ◽  
Surface Finishes ◽  
Immersion Silver ◽  
Manufacturing Environments

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.

Sign in / Sign up

Export Citation Format

Share Document