High quality MOCVD GaN film grown on sapphire substrates using HT-AlN buffer layer

2006 ◽  
Vol 352 (23-25) ◽  
pp. 2332-2334 ◽  
Author(s):  
B. Potì ◽  
M.A. Tagliente ◽  
A. Passaseo
1986 ◽  
Vol 48 (5) ◽  
pp. 353-355 ◽  
Author(s):  
H. Amano ◽  
N. Sawaki ◽  
I. Akasaki ◽  
Y. Toyoda

1999 ◽  
Vol 200 (1-2) ◽  
pp. 63-69 ◽  
Author(s):  
Jin Soo Hwang ◽  
Satoru Tanaka ◽  
Sohachi Iwai ◽  
Yoshinobu Aoyagi ◽  
Seeyearl Seong

1995 ◽  
Vol 395 ◽  
Author(s):  
Peter E. Norris ◽  
Long D. Zhu ◽  
H. Paul Maruska ◽  
Wilson HO ◽  
Scott Ustin ◽  
...  

ABSTRACTGaN was grown by supersonic jet epitaxy(SSJE), seeding triethylgallium in helium carrier gas. Activated nitrogen was supplied by a microwave plasma source. Single crystalline GaN films were deposited on the Si-face 6H-SiC and the c-plane sapphire substrates at 600–670°C. A cubic SiC buffer layer was grown onSi(111) at 800°C by SSJE using dichlorosilane, acetylene, and a high quality GaN crystal was grown on this template at 630°C. The materials high quality was proved by hard rectifying characteristics of a diode with an N-GaN/β-SiC/P-Si(111) structure.


2006 ◽  
Vol 21 (5) ◽  
pp. 702-708 ◽  
Author(s):  
D Gogova ◽  
D Siche ◽  
R Fornari ◽  
B Monemar ◽  
P Gibart ◽  
...  

2008 ◽  
Vol 1068 ◽  
Author(s):  
Yuen-Yee Wong ◽  
Edward Yi Chang ◽  
Tsung-Hsi Yang ◽  
Jet-Rung Chang ◽  
Yi-Cheng Chen ◽  
...  

ABSTRACTThe defect structure of the GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) technique was found to be dependent on the AlN buffer layer growth temperature. This buffer growth temperature controlled the defect density in GaN film but had shown contrary effects on the density of screw threading dislocation (TD) and edge TD. The density of screw TD was high on lower temperature buffer but low on the higher temperature buffer. Meanwhile the density of edge TD had shown the opposite. Further examinations have suggested that the defect structure was closely related to the stress in the GaN film, which can be controlled by the growth temperature of the AlN buffer. Using the 525°C AlN buffer, optimum quality GaN film with relatively low screw and edge TDs were achieved.


2016 ◽  
Vol 9 (2) ◽  
pp. 025501 ◽  
Author(s):  
Hideto Miyake ◽  
Gou Nishio ◽  
Shuhei Suzuki ◽  
Kazumasa Hiramatsu ◽  
Hiroyuki Fukuyama ◽  
...  

AIP Advances ◽  
2017 ◽  
Vol 7 (5) ◽  
pp. 055110 ◽  
Author(s):  
Chia-Yen Huang ◽  
Pei-Yu Wu ◽  
Kai-Shiang Chang ◽  
Yun-Hsiang Lin ◽  
Wei-Chih Peng ◽  
...  

2013 ◽  
Vol 9 (3) ◽  
pp. 367-370 ◽  
Author(s):  
S. J. Bak ◽  
D. -H. Mun ◽  
K. C. Jung ◽  
J. H. Park ◽  
H. J. Bae ◽  
...  
Keyword(s):  

2016 ◽  
Vol 9 (8) ◽  
pp. 081001 ◽  
Author(s):  
Chia-Hung Lin ◽  
Shinya Tamaki ◽  
Yasuhiro Yamashita ◽  
Hideto Miyake ◽  
Kazumasa Hiramatsu

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