Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface

2021 ◽  
Vol 181 ◽  
pp. 111448
Author(s):  
Shuhui Chen ◽  
Lingyue Tan ◽  
Chenlin Yang ◽  
Peixin Chen ◽  
Anmin Hu ◽  
...  
Keyword(s):  
Barrier Layers

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

2003 ◽  
Vol 766 ◽  
Author(s):  
A. Sekiguchi ◽  
J. Koike ◽  
K. Ueoka ◽  
J. Ye ◽  
H. Okamura ◽  
...  
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Nitrogen Concentration ◽  
Scratch Test ◽  
Barrier Structure ◽  
Barrier Layers ◽  
Cu Metallization ◽  
Microstructure Observation ◽  
Sputter Deposited ◽  
Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

Barrier layers and tropical Atlantic SST biases in coupled GCMs

2008 ◽  
Author(s):  
W. -P. Breugem ◽  
P. Chang ◽  
C. J. Jang ◽  
J. Mignot ◽  
W. Hazeleger
Keyword(s):  
Tropical Atlantic ◽  
Barrier Layers

Atomic Layer Deposited Materials as Barrier Layers for Preservation of Nb Superconductivity in Multilayered Thin-Film Structures

2021 ◽  
pp. 1-1
Author(s):  
Vaibhav Gupta ◽  
Mark L. Adams ◽  
John A. Sellers ◽  
Noah Niedzwiecki ◽  
Nick Rush ◽  
...  
Keyword(s):  
Thin Film ◽  
Atomic Layer ◽  
Multilayered Thin Film ◽  
Barrier Layers

Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

2007 ◽  
Vol 84 (11) ◽  
pp. 2669-2674 ◽  
Author(s):  
C. Zhao ◽  
Zs. Tőkei ◽  
A. Haider ◽  
S. Demuynck
Keyword(s):  
Failure Mechanisms ◽  
Barrier Layers

Inhibition of chemical interaction of molybdenum and silicon in a Mo/Si multilayer structure by the formation of intermediate compounds

2021 ◽  
Author(s):  
Elena O. Filatova ◽  
Sergei S. Sakhonenkov ◽  
Aidar U. Gaisin ◽  
Aleksei S. Konashuk ◽  
Ratibor G. Chumakov ◽  
...  
Keyword(s):  
Multilayer Structure ◽  
Chemical Interaction ◽  
Barrier Layers

In the present study, the formation of intermediate compounds in the Mo/Si multilayer was realized by the introduction of barrier layers at the interfaces.

Intercalation of Thin-Film Gd-Doped Ceria Barrier Layers in Electrolyte-Supported Solid Oxide Cells: Physicochemical Aspects

2021 ◽  
Author(s):  
Matthias Riegraf ◽  
Feng Han ◽  
Noriko Sata ◽  
Rémi Costa
Keyword(s):  
Thin Film ◽  
Solid Oxide ◽  
Doped Ceria ◽  
Barrier Layers

scholarly journals Conduction band fluctuation scattering due to alloy clustering in barrier layers in InAlN/GaN heterostructures

AIP Advances ◽  
2017 ◽  
Vol 7 (12) ◽  
pp. 125103
Author(s):  
Qun Li ◽  
Qian Chen ◽  
Jing Chong
Keyword(s):  
Conduction Band ◽  
Barrier Layers

scholarly journals Barrier Layers in a High-resolution Model in the Eastern Tropical Pacific

2020 ◽  
Author(s):  
Frederick M Bingham ◽  
Zhijin Li ◽  
Shota Katsura ◽  
Janet Sprintall
Keyword(s):  
High Resolution ◽  
Tropical Pacific ◽  
Eastern Tropical Pacific ◽  
Barrier Layers ◽  
Resolution Model ◽  
High Resolution Model
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