scholarly journals Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

2020 ◽  
Vol 192 ◽  
pp. 108718 ◽  
Author(s):  
Yangyang Long ◽  
Bo He ◽  
Weizhe Cui ◽  
Yuhang Ji ◽  
Xiaoying Zhuang ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Wire Bonding ◽  
Dynamics Simulation ◽  
Ultrasonic Wire Bonding

Molecular Dynamic Simulation on Mechanism of Ultrasonic Wire Bonding in Electronic Package

2010 ◽  
Vol 97-101 ◽  
pp. 2639-2643 ◽  
Author(s):  
Yong Ding ◽  
Jang Kyo Kim ◽  
Rong Yue Zheng
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Adhesive Force ◽  
Wire Bonding ◽  
Dynamics Simulation ◽  
Real Contact Area ◽  
Microscopic Mechanism ◽  
Element Analysis ◽  
The Real ◽  
Ultrasonic Wire Bonding

The microscopic mechanism of ultrasonic wire bonding is investigated by molecular dynamics simulation on the interfacial contact and adhesion. Considering that the real bonding area is in the state of plane strain, a two-dimensional atomic model is presented. Sutton-Chen potential is adopted for the interaction between gold atoms. Computational results indicate that a strong adhesion generates at the interface after intimate contact between the wire and the bond pad, and the adhesive force should be the mechanism of ultrasonic wire bonding. Combining the real contact area from finite element analysis with the adhesive force from molecular dynamics simulation, the bonding strength of ultrasonic wire bonding is estimated.

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