Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air

2016 ◽  
Vol 166 ◽  
pp. 219-222 ◽  
Author(s):  
Zhiwei Lai ◽  
Xiaoguang Chen ◽  
Chuan Pan ◽  
Ruishan Xie ◽  
Lei Liu ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Mg Alloys ◽  
Transient Liquid Phase Bonding ◽  
Ultrasonic Assisted ◽  
Bonding Method

scholarly journals Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

2020 ◽  
Vol 12 (10) ◽  
pp. 168781402096653
Author(s):  
Yan Bi ◽  
Yong Nie ◽  
Qian Wang ◽  
Jian Han ◽  
Yangchuan Cai
Keyword(s):  
Mechanical Properties ◽  
Liquid Phase ◽  
Ultrasonic Vibration ◽  
Weld Seam ◽  
Transient Liquid Phase ◽  
Coarse Grained ◽  
Transient Liquid Phase Bonding ◽  
Microstructure And Mechanical Properties ◽  
Ultrasonic Assisted ◽  
Pure Cu

Ultrasonic-assisted transient liquid phase bonding of pure Cu with Sn-In solder was realized at 140°C in air. Shear test was carried out on the weldment. The effect of ultrasonic vibration on microstructure and mechanical properties of the weld seam was studied. The relationship between the formation of intermetallic compounds and their mechanical properties was analyzed by means of electronic scanning and element analysis. (Sn) solid solution, ε(Cu3Sn), η(Cu6Sn5), Cu10Sn3, Cu11In9, Cu9In4, γ, β phase were detected in the weld seam. When the ultrasonic vibration time is 30 s, the shear strength reached a maximum of 22.76 MPa. The fracture occurred on the surface of the fine-grained η(Cu6Sn5) phase. The fracture surface was partially covered with coarse-grained Cu11In9 phase, which belonged to a brittle fracture.

Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

2022 ◽  
Vol 149 ◽  
pp. 111713
Author(s):  
Jianhao Wang ◽  
Xunda Liu ◽  
Fupeng Huo ◽  
Kento Kariya ◽  
Noriyuki Masago ◽  
...  
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Die Attach ◽  
Bonding Method
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