Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler

2021 ◽  
pp. 131490
Author(s):  
Xiaowei Wu ◽  
Zhuolin Li ◽  
Xiaoguo Song ◽  
Hongjie Dong ◽  
Xiaoyu Yang ◽  
...  
Author(s):  
B. Van Meerbeek ◽  
L. J. Conn ◽  
E. S. Duke

Restoration of decayed teeth with tooth-colored materials that can be bonded to tooth tissue has been a highly desirable property in restorative dentistry for many years. Advantages of such an adhesive restorative technique over conventional techniques using non-adhesive metal-based restoratives include improved restoration retention with minimal sacrifice of sound tooth tissue for retention purposes, superior adaptation and sealing of the restoration margins in prevention of caries recurrence, improved stress distribution across the tooth-restoration interface throughout the whole tooth, and even reinforcement of weakened tooth structures. The dental adhesive technology is rapidly changing. An efficient resin bond to enamel has already long been achieved. Its bonding mechanism has been fully elucidated and has proven to be a durable and reliable clinical treatment. However, bonding to dentin represents a greater challenge. After the failures of a dentin acid-etch technique in imitation of the enamel phosphoric-acid-etch technique and a bonding procedure based on chemical adhesion, modern dentin adhesives are currently believed to bond to dentin by a micromechanical hybridization process. This process is developed by an initial demineralization of the dentin surface layer with acid etchants exposing a collagen fibril arrangement with interfibrillar microporosities that subsequently become impregnated by low-viscosity monomers. Although the development of such a hybridization process has well been documented in the literature, questions remain with respect to parameters of-primary importance to adhesive efficacy.


1998 ◽  
Vol 37 (S1) ◽  
pp. 5 ◽  
Author(s):  
Jong-Won Lee ◽  
George H. Sigel, Jr.

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Tingting Zhang ◽  
Wenxian Wang ◽  
Zhifeng Yan ◽  
Jie Zhang

AbstractInterfacial structure greatly affects the mechanical properties of laminated plates. However, the critical material properties that impact the interfacial morphology, appearance, and associated bonding mechanism of explosive welded plates are still unknown. In this paper, the same base plate (AZ31B alloy) and different flyer metals (aluminum alloy, copper, and stainless steel) were used to investigate interfacial morphology and structure. SEM and TEM results showed that typical sine wave, wave-like, and half-wave-like interfaces were found at the bonding interfaces of Al/Mg, Cu/Mg and SS/Mg clad plates, respectively. The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals. The results of the microstructural distribution at the bonding interface indicated metallurgical bonding, instead of the commonly believed solid-state bonding, in the explosive welded clad plate. In addition, the shear strength of the bonding interface of the explosive welded Al/Mg, Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa, 147.8 MPa, and 128.4 MPa, respectively. The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.


2021 ◽  
Vol 129 (5) ◽  
pp. 053104
Author(s):  
Yan Jiao ◽  
Mengting Guo ◽  
Renle Wang ◽  
Chongyun Shao ◽  
Lili Hu

2008 ◽  
Vol 354 (26) ◽  
pp. 3059-3071 ◽  
Author(s):  
Robert E. Noons ◽  
Robin Devonshire ◽  
Terry V. Clapp ◽  
Suresh M. Ojha ◽  
Orla McCarthy

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