Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

Microelectronic Engineering ◽

10.1016/j.mee.2008.05.038 ◽

2008 ◽

Vol 85 (11) ◽

pp. 2202-2206 ◽

Author(s):

Yong-Sung Eom ◽

Keonsoo Jang ◽

Jong-Tae Moon ◽

Jae-Do Nam ◽

Jong-Min Kim

Keyword(s):

Melting Point ◽

Mechanical Characterization ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

Download Full-text

Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler

Microelectronics Reliability ◽

10.1016/j.microrel.2009.11.009 ◽

2010 ◽

Vol 50 (2) ◽

pp. 258-265 ◽

Author(s):

Hyomi Kim ◽

Jongmin Kim ◽

Jooheon Kim

Keyword(s):

Melting Point ◽

Carboxylic Acid ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Download Full-text

Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.mb200819 ◽

2008 ◽

Vol 49 (11) ◽

pp. 2572-2578 ◽

Author(s):

Jin Woon Lee ◽

Seong Hyuk Lee ◽

Jong-Min Kim ◽

Jae Hyung Kim ◽

Jung Hee Lee

Keyword(s):

Melting Point ◽

Numerical Investigation ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Self Organized ◽

Download Full-text

Electrical and Mechanical Characterization of Carbon Nanotube Filled Conductive Adhesive

2006 IEEE Aerospace Conference ◽

10.1109/aero.2006.1655965 ◽

2006 ◽

Author(s):

Jing Li ◽

J.K. Lumpp

Keyword(s):

Carbon Nanotube ◽

Mechanical Characterization ◽

Conductive Adhesive

Download Full-text

Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

Journal of Electronic Materials ◽

10.1007/s11664-005-0200-8 ◽

2005 ◽

Vol 34 (11) ◽

pp. 1420-1427 ◽

Author(s):

Liqiang Cao ◽

Shiming Li ◽

Zonghe Lai ◽

Johan Liu

Keyword(s):

Conductive Adhesive ◽

Microelectronics Packaging ◽

Anisotropic Conductive Adhesive

Download Full-text

Enhancement of Wetting Characteristics for Anisotropic Conductive Adhesive with Low Melting Point Solder via Carboxylic Acid-based Novel Reductants

Polymer Korea ◽

10.7317/pk.2010.34.1.52 ◽

2010 ◽

Vol 34 (1) ◽

pp. 52-57

Author(s):

Hyo Mi Kim ◽

Joo Heon Kim

Keyword(s):

Melting Point ◽

Carboxylic Acid ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

Download Full-text

Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder

Microelectronic Engineering ◽

10.1016/j.mee.2009.12.020 ◽

2010 ◽

Vol 87 (10) ◽

pp. 1968-1972 ◽

Author(s):

Ji-Won Baek ◽

Keon-Soo Jang ◽

Yong-Sung Eom ◽

Jong-Tae Moon ◽

Jong-Min Kim ◽

...

Keyword(s):

Melting Point ◽

Adhesive System ◽

Conductive Adhesive ◽

Rheological Characteristics ◽

Anisotropic Conductive Adhesive ◽

Self Assembling

Download Full-text

Electrical characterization of Anisotropic conductive adhesive based flip chip for a direct access sensor

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490945 ◽

2010 ◽

Author(s):

Pio Jesudoss ◽

Wenbin Chen ◽

Alan Mathewson ◽

William M. D. Wright ◽

Kevin G. McCarthy ◽

...

Keyword(s):

Flip Chip ◽

Electrical Characterization ◽

Conductive Adhesive ◽

Direct Access ◽

Anisotropic Conductive Adhesive

Download Full-text

Characterization of mechanical properties of metalcoated polymer spheres for anisotropic conductive adhesive

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. ◽

10.1109/isapm.2005.1432077 ◽

2005 ◽

Author(s):

H. Kristiansen ◽

Z.L. Zhang ◽

J. Liu

Keyword(s):

Mechanical Properties ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Polymer Spheres

Download Full-text

Mechanical characterization of Trebisacce stone: preliminary results

Rendiconti online della Società Geologica Italiana ◽

10.3301/rol.2016.14 ◽

2016 ◽

Vol 38 ◽

pp. 47-50

Author(s):

Giulia Forestieri ◽

Maurizio Ponte

Keyword(s):

Mechanical Characterization ◽

Preliminary Results

Download Full-text

Massively Parallel Mechanical Characterization of Nanowires

10.26226/morressier.5f5f8e69aa777f8ba5bd5f86 ◽

2020 ◽

Author(s):

Rodrigo Bernal

Keyword(s):

Mechanical Characterization ◽

Massively Parallel

Download Full-text