Wafer-level thin-film encapsulation for MEMS

Microelectronic Engineering ◽

10.1016/j.mee.2008.12.047 ◽

2009 ◽

Vol 86 (4-6) ◽

pp. 1311-1313 ◽

Author(s):

Conor O’Mahony ◽

Martin Hill ◽

Zbigniew Olszewski ◽

Alan Blake

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Thin Film Encapsulation for Secondary Batteries on Wafer Level

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.280196 ◽

2006 ◽

Author(s):

K. Marquardt ◽

R. Hahn ◽

T. Luger ◽

H. Reichl

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Thin-film encapsulation technology for above-IC MEMS wafer-level packaging

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/23/12/125012 ◽

2013 ◽

Vol 23 (12) ◽

pp. 125012 ◽

Author(s):

Qing Zhang ◽

Paul-Vahé Cicek ◽

Frederic Nabki ◽

Mourad El-Gamal

Keyword(s):

Thin Film ◽

Wafer Level ◽

Wafer Level Packaging ◽

Thin Film Encapsulation

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Wafer Level Thin Film Encapsulation for BAW RF MEMS

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373858 ◽

2007 ◽

Author(s):

J.L. Pornin ◽

C. Gillot ◽

G. Parat ◽

F. Jacquet ◽

E. Lagoutte ◽

...

Keyword(s):

Thin Film ◽

Rf Mems ◽

Wafer Level ◽

Thin Film Encapsulation

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Robust Wafer-Level Thin-Film Encapsulation of Microstructures using Low Stress PECVD Silicon Carbide

2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems ◽

10.1109/memsys.2009.4805338 ◽

2009 ◽

Author(s):

V. Rajaraman ◽

L.S. Pakula ◽

H.T.M. Pham ◽

P.M. Sarro ◽

P.J. French

Keyword(s):

Thin Film ◽

Silicon Carbide ◽

Wafer Level ◽

Thin Film Encapsulation

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Wafer Level Thin Film Encapsulation for MEMS

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ◽

10.1109/hdp.2005.251432 ◽

2005 ◽

Author(s):

C. Gillot ◽

E. Lagoutte ◽

P.L. Charvet ◽

F. Souchon ◽

N. Sillon

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550071 ◽

2008 ◽

Author(s):

Y. Shimooka ◽

M. Inoue ◽

M. Endo ◽

S. Obata ◽

A. Kojima ◽

...

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Low-temperature solder bonding and thin film encapsulation for wafer level packaged MEMS aiming at harsh environment

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) ◽

10.23919/ltb-3d.2017.7947408 ◽

2017 ◽

Author(s):

Chengkuo Lee

Keyword(s):

Thin Film ◽

Low Temperature ◽

Harsh Environment ◽

Wafer Level ◽

Thin Film Encapsulation

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Wafer Level Thin Film Encapsulation for MEMS

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614401 ◽

2006 ◽

Author(s):

C. Gillot ◽

J.L. Pornin ◽

A. Arnaud ◽

E. Lagoutte ◽

N. Sillon ◽

...

Keyword(s):

Thin Film ◽

Wafer Level ◽

Thin Film Encapsulation

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Sputter Deposition of YSZ Epitaxial Buffer Layer at Wafer Level for Piezoelectric MEMS Utilizing PZT-based Monocrystalline Thin Film

IEEJ Transactions on Sensors and Micromachines ◽

10.1541/ieejsmas.136.437 ◽

2016 ◽

Vol 136 (10) ◽

pp. 437-442 ◽

Author(s):

Shinsuke Nishizawa ◽

Shinya Yoshida ◽

Kiyotaka Wasa ◽

Shuji Tanaka

Keyword(s):

Thin Film ◽

Buffer Layer ◽

Sputter Deposition ◽

Wafer Level ◽

Piezoelectric Mems

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Thin Film Encapsulation of Organic Solar Cells by Direct Deposition of Polysilazanes from Solution

Advanced Energy Materials ◽

10.1002/aenm.201900598 ◽

2019 ◽

pp. 1900598 ◽

Author(s):

Iftikhar Ahmed Channa ◽

Andreas Distler ◽

Michael Zaiser ◽

Christoph J. Brabec ◽

Hans‐Joachim Egelhaaf

Keyword(s):

Thin Film ◽

Solar Cells ◽

Organic Solar Cells ◽

Direct Deposition ◽

Thin Film Encapsulation

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