2005 7th Electronic Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

167

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780395786

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614405 ◽

2006 ◽

Cited By ~ 1

Author(s):

Chang-Lin Yeh ◽

Yi-Shao Lai ◽

Hsiao-Chuan Chang ◽

Tsan-Hsien Chen

Keyword(s):

Impact Test ◽

Drop Test ◽

Ball Impact ◽

Board Level

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High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614478 ◽

2006 ◽

Cited By ~ 1

Author(s):

S.T. Jenq ◽

H.S. Sheu ◽

Chang-Lin Yeh ◽

Yi-Shao Lai ◽

Jenq-Dah Wu

Keyword(s):

Failure Analysis ◽

Printed Circuit Board ◽

Drop Impact ◽

Impact Response ◽

Circuit Board ◽

Printed Circuit

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Growth of Aligned Carbon Nanotube Arrays for Electrical Interconnect

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614481 ◽

2006 ◽

Cited By ~ 1

Author(s):

Lingbo Zhu ◽

Yonghao Xiu ◽

D.W. Hess ◽

C.P. Wong

Keyword(s):

Carbon Nanotube ◽

Nanotube Arrays ◽

Carbon Nanotube Arrays

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Process Characteristics of 100μm Bump Pitch with Lead-Free and High Lead Plating Solder Bump

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614455 ◽

2006 ◽

Author(s):

R. Yu ◽

J.-I. Yu ◽

T. Tai ◽

C.H. Kang ◽

J. Chen ◽

...

Keyword(s):

Solder Bump ◽

Lead Free ◽

Process Characteristics ◽

High Lead

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Experimental study of a radial micro-channel cooling plate

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614484 ◽

2006 ◽

Cited By ~ 5

Author(s):

A. Poppe ◽

Gy. Horvath ◽

Gy. Bognar ◽

Zs. Kohari ◽

M.P.Y. Desmulliez ◽

...

Keyword(s):

Experimental Study ◽

Micro Channel ◽

Cooling Plate

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The More Accurate Method to Extract Dielectric Constant and Loss Tangent of Insulated Material on Microwave Frequencies

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614509 ◽

2006 ◽

Author(s):

Chia-Hsing Chou ◽

Pao-Nan Li ◽

Sung-Mao Wu

Keyword(s):

Dielectric Constant ◽

Loss Tangent ◽

Accurate Method ◽

Microwave Frequencies ◽

Dielectric Constant And Loss

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Post-curing Influence on Electrostatic Charges Deposited on Epoxy/Silica Composites used for Microelectronic Packaging

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614498 ◽

2006 ◽

Cited By ~ 1

Author(s):

A. Sylvestre ◽

H. Ouajji ◽

P. Gonon ◽

J. Teysseyre ◽

F. Jomni ◽

...

Keyword(s):

Microelectronic Packaging ◽

Electrostatic Charges

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Passive Two-Phase Cooling Solution with a Novel Heat Transfer Enhancement Technique for Electronic Packages

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614486 ◽

2006 ◽

Author(s):

N. Khan ◽

D. Pinjala ◽

K.C. Toh

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Electronic Packages ◽

Transfer Enhancement ◽

Two Phase ◽

Enhancement Technique ◽

Two Phase Cooling

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Characterization and Modeling of Hygroscopic Swelling and its Impact on Failures of a Flip Chip Package with No-flow Underfill

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614466 ◽

2006 ◽

Cited By ~ 3

Author(s):

Jiang Zhou ◽

Tong Yan Tee ◽

Xueren Zhang ◽

Jing-en Luan

Keyword(s):

Flip Chip ◽

Hygroscopic Swelling

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Feasibility Study on Board Assembly of TSSOP Components with NiPdAu PPF Finish

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614499 ◽

2006 ◽

Cited By ~ 1

Author(s):

X.J. Zhao ◽

J.F.J.M. Caers

Keyword(s):

Feasibility Study

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2005 7th Electronic Packaging Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board

Growth of Aligned Carbon Nanotube Arrays for Electrical Interconnect

Process Characteristics of 100μm Bump Pitch with Lead-Free and High Lead Plating Solder Bump

Experimental study of a radial micro-channel cooling plate

The More Accurate Method to Extract Dielectric Constant and Loss Tangent of Insulated Material on Microwave Frequencies

Post-curing Influence on Electrostatic Charges Deposited on Epoxy/Silica Composites used for Microelectronic Packaging

Passive Two-Phase Cooling Solution with a Novel Heat Transfer Enhancement Technique for Electronic Packages

Characterization and Modeling of Hygroscopic Swelling and its Impact on Failures of a Flip Chip Package with No-flow Underfill

Feasibility Study on Board Assembly of TSSOP Components with NiPdAu PPF Finish

2005 7th Electronic Packaging Technology Conference
Latest Publications