2005 7th Electronic Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

167

(FIVE YEARS 0)

H-INDEX

8

(FIVE YEARS 0)

Published By IEEE

0780395786

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Experimental study of a radial micro-channel cooling plate

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614484 ◽

2006 ◽

Author(s):

A. Poppe ◽

Gy. Horvath ◽

Gy. Bognar ◽

Zs. Kohari ◽

M.P.Y. Desmulliez ◽

...

Keyword(s):

Experimental Study ◽

Micro Channel ◽

Download Full-text

The More Accurate Method to Extract Dielectric Constant and Loss Tangent of Insulated Material on Microwave Frequencies

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614509 ◽

2006 ◽

Author(s):

Chia-Hsing Chou ◽

Pao-Nan Li ◽

Sung-Mao Wu

Keyword(s):

Dielectric Constant ◽

Loss Tangent ◽

Accurate Method ◽

Microwave Frequencies ◽

Dielectric Constant And Loss

Download Full-text

Post-curing Influence on Electrostatic Charges Deposited on Epoxy/Silica Composites used for Microelectronic Packaging

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614498 ◽

2006 ◽

Author(s):

A. Sylvestre ◽

H. Ouajji ◽

P. Gonon ◽

J. Teysseyre ◽

F. Jomni ◽

...

Keyword(s):

Microelectronic Packaging ◽

Electrostatic Charges

Download Full-text

Passive Two-Phase Cooling Solution with a Novel Heat Transfer Enhancement Technique for Electronic Packages

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614486 ◽

2006 ◽

Author(s):

N. Khan ◽

D. Pinjala ◽

K.C. Toh

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Electronic Packages ◽

Transfer Enhancement ◽

Two Phase ◽

Enhancement Technique ◽

Two Phase Cooling

Download Full-text

Characterization and Modeling of Hygroscopic Swelling and its Impact on Failures of a Flip Chip Package with No-flow Underfill

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614466 ◽

2006 ◽

Author(s):

Jiang Zhou ◽

Tong Yan Tee ◽

Xueren Zhang ◽

Jing-en Luan

Keyword(s):

Flip Chip ◽

Hygroscopic Swelling

Download Full-text

Feasibility Study on Board Assembly of TSSOP Components with NiPdAu PPF Finish

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614499 ◽

2006 ◽

Author(s):

X.J. Zhao ◽

J.F.J.M. Caers

Keyword(s):

Feasibility Study

Download Full-text

Non-linear Finite Element Analysis for Electronic Packages Subjected to Combined Hygroscopic and Thermo-mechanical Stresses

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614467 ◽

2006 ◽

Author(s):

S. Yoon ◽

Bongtae Han ◽

Seungmin Cho ◽

Chang-Soo Jang

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Mechanical Stresses ◽

Electronic Packages ◽

Element Analysis ◽

Linear Finite Element ◽

Download Full-text

Development of Demonstrator Kit for Designing Practical EMC Compliant System

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614391 ◽

2006 ◽

Author(s):

Kye Yak See ◽

M. Oswal ◽

W. Khan-ngern ◽

F. Canavero ◽

C. Christopoulos ◽

...

Download Full-text

Process Characteristics of 100μm Bump Pitch with Lead-Free and High Lead Plating Solder Bump

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614455 ◽

2006 ◽

Author(s):

R. Yu ◽

J.-I. Yu ◽

T. Tai ◽

C.H. Kang ◽

J. Chen ◽

...

Keyword(s):

Solder Bump ◽

Lead Free ◽

Process Characteristics ◽

Download Full-text

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614405 ◽

2006 ◽

Author(s):

Chang-Lin Yeh ◽

Yi-Shao Lai ◽

Hsiao-Chuan Chang ◽

Tsan-Hsien Chen

Keyword(s):

Impact Test ◽

Drop Test ◽

Ball Impact ◽

Download Full-text