Spark plasma sintering of Li/Ta-modified (K,Na)NbO3 lead-free piezoelectric ceramics: Post-annealing temperature effect on phase structure, electrical properties and grain growth behavior

2011 ◽  
Vol 176 (14) ◽  
pp. 1110-1114 ◽  
Author(s):  
Yuhua Zhen ◽  
Jing-Feng Li ◽  
Ke Wang ◽  
Youguo Yan ◽  
Lianqing Yu
Keyword(s):  
Electrical Properties ◽  
Grain Growth ◽  
Annealing Temperature ◽  
Growth Behavior ◽  
Lead Free ◽  
Post Annealing ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Grain Growth Behavior ◽  
Post Annealing Temperature

Sintering characteristics and grain growth behavior of MgO nanopowders by spark plasma sintering

2014 ◽  
Vol 608 ◽  
pp. 304-310 ◽  
Author(s):  
Yongfen Zhang ◽  
Aijun Song ◽  
Deqiang Ma ◽  
Xinyu Zhang ◽  
Mingzhen Ma ◽  
...  
Keyword(s):  
Grain Growth ◽  
Spark Plasma Sintering ◽  
Growth Behavior ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Sintering Characteristics ◽  
Grain Growth Behavior

Thermal Stability and Mechanical Properties of Nanocrystalline L12 Al3Hf and (Al+12.5 at.%Zn)3Hf Prepared by MA and SPS

2004 ◽  
Vol 449-452 ◽  
pp. 809-812 ◽  
Author(s):  
Chang Won Kang ◽  
Hee Sup Jang ◽  
Seon Jin Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Fracture Toughness ◽  
Phase Transformation ◽  
Grain Growth ◽  
Annealing Temperature ◽  
Annealing Temperatures ◽  
Grain Sizes ◽  
Plasma Sintering ◽  
Spark Plasma

Thermal stability and mechanical properties of L12 Al3Hf and (Al+12.5 at.%Zn))3Hf synthesized by mechanical alloying(MA) and spark plasma sintering(SPS) were investigated. Nanocrystalline L12 phase was produced after MA for 8 and 10 hrs in Al3Hf and (Al+12.5 at.%Zn))3Hf powders, respectively. The grain sizes were reduced to about 10 nm in both systems after MA for 20 hrs. After SPS, L12 phase was maintained only in Zn added system. In (Al+12.5 at.%Zn))3Hf, L12 to D023 phase transformation was started at about 850°C and finished at about 1150°C Microhardness was decreased with increasing the annealing temperature while fracture toughness was increased due to the grain growth. Fracture toughness of (Al+12.5 at.%Zn))3Hf was greater than that of Al3Hf in all annealing temperatures. Fracture toughness of (Al+12.5 at.%Zn))3Hf after annealing at 1200°C was about 5.38 MPam1/2.

scholarly journals The electrical properties of PLZT thin films on ITO coated glass with various post-annealing temperature

2008 ◽  
Vol 17 (1) ◽  
pp. 28-33
Author(s):  
Won-Hyo Cha ◽  
Ji-Eon Youn ◽  
Dong-Hyun Hwang ◽  
Chul-Su Lee ◽  
In-Seok Lee ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Annealing Temperature ◽  
Coated Glass ◽  
Post Annealing ◽  
Plzt Thin Films ◽  
Post Annealing Temperature

Comparison of Abnormal Grain Growth Behavior of Lead-Free (Na,K)NbO3-M(Cu,Nb)O3, (M = Ca, Sr, Ba) Piezoelectric Ceramics

2020 ◽  
Vol 30 (7) ◽  
pp. 343-349
Author(s):  
Seungwoon Jung ◽  
Ji-Ho Lim ◽  
Han-Bo Jung ◽  
Sung-Yub Ji ◽  
Seunggon Choi ◽  
...  
Keyword(s):  
Grain Growth ◽  
Piezoelectric Ceramics ◽  
Growth Behavior ◽  
Abnormal Grain Growth ◽  
Lead Free ◽  
Grain Growth Behavior
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