Anisotropic thermal expansion behaviors of copper matrix in β-eucryptite/copper composite

2012 ◽  
Vol 177 (11) ◽  
pp. 873-876 ◽  
Author(s):  
Lidong Wang ◽  
Zongwei Xue ◽  
Yingjie Qiao ◽  
W.D. Fei
2013 ◽  
Vol 702 ◽  
pp. 202-206 ◽  
Author(s):  
Qing Yun Wang ◽  
Wei Ping Shen ◽  
Ming Liang Ma

Heat sink materials not only should have higher thermal conductivity, but also have smaller difference of thermal expansion with cooled material. diamond/copper composites were made by the powder metallurgy method. Vacuum slowly vapor deposition technique was employed to deposit a titanium film on diamond particles before mixing with Cu powder in order to improve the bonding strength between Cu and diamond particles during sintering. The thermal expansion of diamond/Cu d composite was measured in the temperature range from 50 to 600 °C. The results show that the titanium film on diamond improves the interfacial bonding and reduces the coefficient of thermal expansion (CTE) of Cu/diamond composites. The CTE of diamond/Cu composites decreases with increasing diamond volume fraction as the results of mixture rule and the intense restriction effect of diamond reinforcement on the copper matrix. The residual stresses and pores in the composites affect instantaneous thermal expansion of diamond/Cu composites.


1979 ◽  
Vol 9 (1) ◽  
pp. 1-20 ◽  
Author(s):  
M Hasegawa ◽  
W H Young ◽  
M J Stott

Author(s):  
Jun Wu ◽  
Honggang Liu ◽  
Zhiyu He ◽  
Hui Luo ◽  
Baojun Chen ◽  
...  

ChemInform ◽  
2015 ◽  
Vol 46 (10) ◽  
pp. no-no
Author(s):  
Hai-Feng Li ◽  
Andrew Wildes ◽  
Binyang Hou ◽  
Cong Zhang ◽  
Berthold Schmitz ◽  
...  

1990 ◽  
Vol 23 (8) ◽  
pp. 1073-1075 ◽  
Author(s):  
Lin Wei ◽  
Dai Guiqing ◽  
Huang Qingzhen ◽  
Zhen An ◽  
Liang Jingkui

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