Fabrication of Polycrystalline Cubic Boron Nitride/Metal Composite Particles by Surface Metallization Followed by Electroless Deposition Technique

Polycrystalline cBN/copper composite abrasive particles were prepared by an electroless powder coating process. Ti metallization and tin/silver metallization techniques were used to improve the coating process by depositing an autocatalytic metallic layer on the surface of the cBN particles. Metallized, as well as un-metallized, cBN particles were further coated by copper using electroless deposition. Electroless copper coating of un-metallized and metallized cBN particles by 90 wt.% of copper were achieved. The surface morphology, the composition and the crystalline phase identifications of the metallized cBN particles, as well as the 10 wt.% cBN /copper composite powders, were investigated by field emission scanning electron microscopy, an energy-dispersive spectrometer and an X-ray diffractometer. The results show that the surface of the Ti metalized and tin/Ag-metallized cBN particles were covered by the nanosized Ti or Ag layer, respectively, which enhanced the deposition of the copper during the electroless deposition bath. The results also showed that the deposited layer on the metallized cBN particles was composed mainly of metallic copper. The produced 10 wt.% cBN/copper composite particles also underwent thermo-gravimetric analysis to investigate its stability at high temperature. It was revealed that the Ti-metallized cBN/copper composite powder has higher stability at 800 °C under the environmental conditions than the tin/silver-metallized and the un-metallized cBN/copper composite particles, respectively.

Effect of dielectric barrier discharge on conductive properties for epoxy/copper composite

The plasma treatment efficient method used improving and Surface treatment of epoxy and increasing the surface roughness. In this paper, epoxy and epoxy/copper are modified by dielectric barrier discharge (DBD) Plasma in presence of air. Modification of the properties of epoxy by preparing doping systems with percentage 1% copper with two different frequencies of the plasma f=7 and 8 kHz and exposure time t =10 min. The results showed a decrease in the energy gap when exposed to plasma and an increase in the surface roughness of epoxy, electrical conductivity of composites increased with temperature.

Influence of Carbon Nanowalls Interlayer on Copper Deposition

This research deals with the deposition of copper on a steel substrate. Two different methods were investigated: electrochemical and magnetron sputtering. The deposition parameters were optimized to obtain a coating layer with uniform granular structure and good adhesion to the substrate. As a novelty, carbon nanowalls (CNW) were used as reinforcement in copper coatings on the steel surface. The morphology of the coatings, adhesion and Vickers microhardness were performed to emphasize the CNW influence on the coating properties. Open circuit potential and Tafel analysis were used for electrochemical characterization. These kinds of CNW-copper composite with improved hardness and adhesion and surface electrical resistance around 1 Ω·cm could have miscellaneous applications in different domains such as aerospace, electronics, automotive and power-generation.

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.