Bonding strength of glass-ceramic trabecular-like coatings to ceramic substrates for prosthetic applications

In thermoelectric modules, multiple n-type and p-type thermoelectric elements are electrically connected in series on a Cu electrode that is bonded to a ceramic substrate. Defects in the bond between the thermoelectric elements and the Cu electrode could impact the performance of the entire thermoelectric module. This study investigated the effect of plating layers on the bonding strength of p-type Bi–Te thermoelectric elements. Ni and Pd electroplating was applied to Bi–Te thermoelectric elements; further, electroless Ni–P immersion gold (ENIG) plating was applied to Cu electrodes bonded to ceramic substrates. Forming a Pd/Ni electroplating layer on the surface of thermoelectric elements and an ENIG plating layer on the surface of the Cu electrode improved the bonding strength by approximately 3.5 times. When the Pd/Ni and ENIG plating layers were formed on Bi–Te elements and Cu substrates, respectively, the solderability greatly increased; as the solderability increased, the thickness of the diffusion layer formed with the solder layer increased. The improved bonding strength of the Pd/Ni plated thermoelectric element bonded on the ENIG plated substrate is attributed to the enhanced solderability due to the rapid inter-diffusion of Pd and Au into the solder layer and the formation of a stable and non-defected solder reaction interface layer.

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Plasma Sprayed Ceramic Coatings on Glass and Glass Ceramic Substrates

Ceramic Transactions Series - Innovative Processing and Synthesis of Ceramics, Glasses, and Composites V ◽

10.1002/9781118370872.ch2 ◽

2012 ◽

pp. 15-30

Author(s):

R. Gadow ◽

A. Killinger ◽

C. Li

Keyword(s):

Glass Ceramic ◽

Ceramic Coatings ◽

Ceramic Substrates ◽

Plasma Sprayed

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Scintillating glass‐ceramic substrates for indirect flat panel detectors in digital radiography

Journal of the American Ceramic Society ◽

10.1111/jace.17408 ◽

2020 ◽

Vol 103 (12) ◽

pp. 6893-6900

Author(s):

Russell L. Leonard ◽

Danielle T. Berkowitz ◽

Austin Thomas ◽

Adrian Howansky ◽

Anthony R. Lubinsky ◽

...

Keyword(s):

Digital Radiography ◽

Glass Ceramic ◽

Flat Panel ◽

Ceramic Substrates ◽

Flat Panel Detectors

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The effect of TiO2 and P2O5 on densification behavior and properties of Anortite-Diopside glass-ceramic substrates

Journal of Electroceramics ◽

10.1007/s10832-009-9586-7 ◽

2009 ◽

Vol 25 (1) ◽

pp. 38-44 ◽

Cited By ~ 6

Author(s):

Vitor M. F. Marques ◽

Dilshat U. Tulyaganov ◽

Govind P. Kothiyal ◽

José M. F. Ferreira

Keyword(s):

Glass Ceramic ◽

Densification Behavior ◽

Ceramic Substrates

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Ceramic-Polyimide Systems for Electronic Packaging

MRS Proceedings ◽

10.1557/proc-304-91 ◽

1993 ◽

Vol 304 ◽

Cited By ~ 3

Author(s):

Wayne E. Marsh ◽

K. Kanakarajan ◽

Garry D. Osborn

Keyword(s):

Aluminum Nitride ◽

Dimensional Stability ◽

Glass Ceramic ◽

High Performance ◽

Electronics Industry ◽

Polyimide Films ◽

Ceramic Substrates ◽

Circuit Fabrication ◽

Aging Conditions ◽

New Material

AbstractA family of new high performance thermoplastic polyimide adhesives have been developed that can be directly laminated to ceramic substrates, polyimide films, metals, and/or sputter metallized for eventual circuit fabrication. We have also developed new heat-sealable composite polyimide films that have improved CTE, that have good dimensional stability and that can also be directly bonded to ceramic and glass-ceramic substrates. With these new material sets various constructions of ceramic-polyimide rigid-flex systems can be conceived to meet the more demanding needs of the electronics industry. We have laminated these films to metals and various ceramic substrates such as alumina, aluminum nitride, glass, etc. and investigated the bond stabilities under thermal and humidity aging conditions.

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