Atomic layer chemical vapour deposition of copper

2004 ◽  
Vol 7 (4-6) ◽  
pp. 343-347 ◽  
Author(s):  
Anil U. Mane ◽  
S.A. Shivashankar
Coatings ◽  
2018 ◽  
Vol 8 (10) ◽  
pp. 369 ◽  
Author(s):  
Richard Krumpolec ◽  
Tomáš Homola ◽  
David Cameron ◽  
Josef Humlíček ◽  
Ondřej Caha ◽  
...  

Sequentially pulsed chemical vapour deposition was used to successfully deposit thin nanocrystalline films of copper(I) chloride using an atomic layer deposition system in order to investigate their application to UV optoelectronics. The films were deposited at 125 °C using [Bis(trimethylsilyl)acetylene](hexafluoroacetylacetonato)copper(I) as a Cu precursor and pyridine hydrochloride as a new Cl precursor. The films were analysed by XRD, X-ray photoelectron spectroscopy (XPS), SEM, photoluminescence, and spectroscopic reflectance. Capping layers of aluminium oxide were deposited in situ by ALD (atomic layer deposition) to avoid environmental degradation. The film adopted a polycrystalline zinc blende-structure. The main contaminants were found to be organic materials from the precursor. Photoluminescence showed the characteristic free and bound exciton emissions from CuCl and the characteristic exciton absorption peaks could also be detected by reflectance measurements.


2020 ◽  
Author(s):  
Matthew Griffiths ◽  
Zachary Dubrawski ◽  
Peter Gordon ◽  
Marcel Junige ◽  
Sean Barry

A survey of known gold-containing chemical vapour deposition (CVD) and atomic layer deposition (ALD) precursors, with a focus on collecting their volatilization and decomposition data. These data were applied to a figure of merit (σ) developed to easily assess the thermal characteristics.


2020 ◽  
Author(s):  
Matthew Griffiths ◽  
Zachary Dubrawski ◽  
Peter Gordon ◽  
Marcel Junige ◽  
Sean Barry

A survey of known gold-containing chemical vapour deposition (CVD) and atomic layer deposition (ALD) precursors, with a focus on collecting their volatilization and decomposition data. These data were applied to a figure of merit (σ) developed to easily assess the thermal characteristics.


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