scholarly journals Lead-free relaxor thin films with huge energy density and low loss for high temperature applications

Nano Energy ◽  
2020 ◽  
Vol 71 ◽  
pp. 104536 ◽  
Author(s):  
A. Kursumovic ◽  
W.-W. Li ◽  
S. Cho ◽  
P.J. Curran ◽  
D.H.L. Tjhe ◽  
...  
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Energy Density ◽  
Lead Free ◽  
Low Loss ◽  
Temperature Applications

Lead-Free Ceramics with High Energy Density and Reduced Losses for High Temperature Applications

2017 ◽  
Vol 19 (6) ◽  
pp. 1700019 ◽  
Author(s):  
Tatiana Correia ◽  
Mark Stewart ◽  
Angela Ellmore ◽  
Knuth Albertsen
Keyword(s):  
High Temperature ◽  
Energy Density ◽  
High Energy ◽  
High Energy Density ◽  
Lead Free ◽  
Lead Free Ceramics ◽  
Temperature Applications

Electrical and morphological characterization of platinum thin-films with various adhesion layers for high temperature applications

2015 ◽  
Vol 23 (3) ◽  
pp. 703-709 ◽  
Author(s):  
A. Ababneh ◽  
A. N. Al-Omari ◽  
A. M. K. Dagamseh ◽  
M. Tantawi ◽  
C. Pauly ◽  
...  
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Morphological Characterization ◽  
Temperature Applications

scholarly journals Gas Separation Properties of Polyimide Thin Films on Ceramic Supports for High Temperature Applications

Membranes ◽  
2018 ◽  
Vol 8 (1) ◽  
pp. 16 ◽  
Author(s):  
Sara Escorihuela ◽  
Alberto Tena ◽  
Sergey Shishatskiy ◽  
Sonia Escolástico ◽  
Torsten Brinkmann ◽  
...  
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Gas Separation ◽  
Temperature Applications

High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

1999 ◽  
Vol 14 (10) ◽  
pp. 3895-3900 ◽  
Author(s):  
J. W. Jang ◽  
P. G. Kim ◽  
K. N. Tu ◽  
Michael Lee
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Wetting Angle ◽  
Lead Free ◽  
Reflow Time ◽  
Diffusion Limited

We report the soldering behaviors of high-temperature (300 °C) lead-free SnSb alloys on Cu foils and phased-in Cu–Cr thin films. By increasing the Sb content from 5 to 15 wt%, the solder surface became rougher and the wetting angle decreased from 50° to 20° on the Cu foils. Interfacial compounds were found to be Cu6Sn5 and Cu3Sn. The Cu6Sn5 showed a scallop-type morphology, whereas the Cu3Sn had a layer-type morphology. The growth of the latter was found to be diffusion limited. On phased-in Cu–Cr thin films, the solders showed much lower wetting angles than on the Cu foils, but the dewetting phenomenon was observed after 1 min of reflow time in the 85Sn15Sb alloy. In comparison, we found no dewetting of the high-temperature 95Pb5Sn solder.

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