All-optical tunable fiber filter based on a few-mode optical fiber mode interferometer coated with graphene epoxy resin composite material

2021 ◽  
pp. 127140
Author(s):  
Enqing Chen ◽  
Bo Dong ◽  
Yang Li ◽  
Ziwan Li ◽  
Xiaoli Wang ◽  
...  
Keyword(s):  
Composite Material ◽  
Optical Fiber ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Epoxy Resin Composite ◽  
All Optical ◽  
Fiber Mode ◽  
Fiber Filter

Electrical properties of low-doped carbon nanotubes/epoxy resin composite material cured in an electric field

2021 ◽  
pp. 1-6
Author(s):  
Ranis Ramisovich Garipov ◽  
Sergei Glebovich L’vov ◽  
Sergei Mansurovich Khantimerov ◽  
Nail Muratovich Suleimanov
Keyword(s):  
Carbon Nanotubes ◽  
Composite Material ◽  
Electrical Properties ◽  
Electric Field ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Epoxy Resin Composite

A study of the mechanical properties of pre-oxidized fiber felt/epoxy resin composite material

2018 ◽  
Vol 109 (10) ◽  
pp. 1335-1340
Author(s):  
Chuanbing Ge ◽  
Yuanjun Liu ◽  
Xiaoming Qian ◽  
Xiaoming Zhao
Keyword(s):  
Mechanical Properties ◽  
Composite Material ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Epoxy Resin Composite

K-2318 Evaluation of Bending test of HAp-Tyranno Fiber and Epoxy resin composite material

2001 ◽  
Vol V.01.1 (0) ◽  
pp. 337-338
Author(s):  
Satoshi MORIKAWA ◽  
Kazuo YAGI ◽  
Masataka TOKUDA ◽  
Shojji NAKAMURA
Keyword(s):  
Composite Material ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Bending Test ◽  
Epoxy Resin Composite

Mesoporous MFI zeolite material from silica–alumina/epoxy-resin composite material and its catalytic activity

2011 ◽  
Vol 142 (1) ◽  
pp. 381-388 ◽  
Author(s):  
Masahiro Fujiwara ◽  
Akinori Sakamoto ◽  
Kumi Shiokawa ◽  
Astam K. Patra ◽  
Asim Bhaumik
Keyword(s):  
Composite Material ◽  
Catalytic Activity ◽  
Epoxy Resin ◽  
Resin Composite ◽  
Mfi Zeolite ◽  
Epoxy Resin Composite ◽  
Silica Alumina

SiO2-coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

2018 ◽  
Vol 31 (4) ◽  
pp. 417-424
Author(s):  
Qing Tian ◽  
Junhui Li ◽  
Xiao Huiwei ◽  
Can Zhou
Keyword(s):  
Electron Microscopy ◽  
Thermal Conductivity ◽  
Composite Material ◽  
Epoxy Resin ◽  
Failure Time ◽  
Coefficient Of Thermal Expansion ◽  
Resin Composite ◽  
Cu Nanoparticles ◽  
Coefficient Of Thermal Conductivity ◽  
Epoxy Resin Composite

A silicon dioxide–copper (SiO2-Cu) epoxy resin composite material for chip packaging was made by a mechanical mixing method with epoxy resin as the base glue and SiO2 coated with nano-Cu (SiO2-Cu) particles as the filler. The dispersion of SiO2-Cu nanoparticles in epoxy resin was studied using scanning electron microscopy and transmission electron microscopy. Meanwhile, the effects of the filler on the coefficient of thermal conductivity, the coefficient of thermal expansion (CTE), and the mechanical properties of the composite material were also studied. The results show that SiO2-Cu nanoparticles disperse well in the epoxy resin, the coefficient of thermal conductivity of SiO2-Cu epoxy resin composites increases with an increase in the SiO2-Cu filler amount, the coefficient of thermal conductivity begins to decline when the filling volume is over 25%, and the suitable amount of SiO2-Cu is 25% of the total volume. With the increase in the filler, the CTE of the composite decreases; when the SiO2-Cu filling amount is 25%, the material has good impact resistance and a long electromigration failure time for chip packaging materials.

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